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描述

The SmartBond™ DA14585 Bluetooth Low Energy Pro Development Kit provides all of the flexibility needed to develop products with confidence, enabling the creation of more advanced connected applications with the smallest footprints and power budgets. At the core of this development kit is our SmartBond™ DA14585. It is the smallest, lowest power, and most integrated Bluetooth® system-on-chip (SoC) solution currently available. This versatile SoC brings Bluetooth 5.0 functionality to our well-known DA1458x family. The DA14585 hardware development environment is available as a starter kit, containing a motherboard and daughterboard. Additional separate daughterboard kits can be ordered.

The motherboard gives access to all of the package’s general-purpose input-outputs (GPIOs), and the on-board SEGGER chip provides the complete debugging capability, while dedicated on-board circuitry allows you, in combination with our complete software environment SmartSnippets™, to profile and fine-tune the power consumption of your application to get the most out of the DA14585’s advantages.

特性

  • Full digital connectivity with external hardware using UART, SPI, GPIO, and I2C.
  • USB-based debugging capabilities using the SEGGER J-Link on-board debugger.
  • USB-based UART communication with the host PC using a Future Technology Devices International (FTDI) chipset, which converts UART to USB.

应用

类型 文档标题 日期
手册 - 开发工具
手册 - 开发工具
手册 - 开发工具
发行说明
登录后下载 PDF 273 KB
发行说明 PDF 160 KB
发行说明
登录后下载 PDF 279 KB
应用说明 PDF 241 KB
AI 生成的摘要: The document provides troubleshooting guidance for managing the SEGGER J-Link interface on DA1458x/68x development kits. It addresses issues such as the unavailability of the Virtual COM (VCOM) port after firmware updates, detailing steps to reinstall the J-Link software and re-enable the VCOM port. It also covers hardware flow control settings and booting problems that may arise post-update. The guide targets specific devices including DA1458x Basic DKs, DA1468x/DA1510x Basic DKs, CIB, and DA14580 USB dongle, ensuring proper operation of the Bluetooth low energy SoC processor through the J-Link interface.
原理图 ZIP 3.32 MB
原理图 ZIP 886 KB
原理图 PDF 79 KB
原理图 ZIP 1.07 MB
原理图 PDF 81 KB
原理图 PDF 214 KB
产品简述 PDF 658 KB English , 日本語
14 项目

相关评估板和套件

开发板与套件

Part NumberStatusStockBudgetary Price (USD)SampleablePb (Lead) Free
DA14585-00ATDEVKT-PActiveIn Stock1u | $98N/AYes
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