概述
描述
Renesas offers the RZ/N1S IO-Link Master development kit. This easy-to-use development kit contributes to shorter prototype-to-production process time and helps to reduce the development burden on engineers.
Components
- IO-Link Gateway development board
Sample Software
- Binary image of IO-Link master stack
Tool
- IO-Link engineering tool for PC
Documentation
- System quick start up guide
- RZ/N user's manuals and board documentation (Incl. components list, schematics of boards)
How To Get
Product name: IO-Link master development kit
This kit is for rental in limited areas only.
For details, please contact your Renesas sales channel.
Related Information
Software partner
特性
- A/D converter (ADC) of the R7S72100 connects to switch
- System power supply control of the RTK7721000B00000BR
- IEBus controller (IEBus) of the R7S72100 connects to IEBus driver
- Local interconnect interface (LIN3) of the R7S72100 connects to LIN driver
- Serial communication interface (SCIc) of the R7S72100 connects to SIM card slot
- IrDA controller (IrDA) of the R7S72100 connects to IrDA module; IrDA 1.0 compliant
- Serial communication interface (SCIc) port of the R7S72100 connects to UART connector
应用
设计和开发
软件与工具
软件与工具
| Software title
|
Software type
|
公司
|
|---|---|---|
| TMG TE IO-Link Master Stack IO‑Link Master Software compliant with the latest IO‑Link specifications delivers a complete communication stack, including the Standardized Master Interface (SMI) and the TMG SMI‑TCP protocol, enabling seamless IO‑Link Master integration. Designed for high portability across a wide range of microcontroller platforms and transceivers, it supports easy deployment and scalability. The included SMI‑TCP protocol enables connectivity to IO‑Link Device Tools, IO‑Link Master Test tools, and IoT applications. Optional gateway packages—such as PROFINET®—extend functionality, making the solution well suited for flexible, scalable IO‑Link Master implementations.
|
Connectivity | TMG TE GmbH |
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