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1024K x 36 Sync, 3.3V/2.5V Dual-Port RAM

封装信息

CAD 模型:View CAD Model
Pkg. Type:CABGA
Pkg. Code:BPG256
Lead Count (#):256
Pkg. Dimensions (mm):17.0 x 17.0 x 1.76
Pitch (mm):1

环境和出口类别

Pb (Lead) FreeYes
Moisture Sensitivity Level (MSL)3
ECCN (US)EAR99
HTS (US)8542.32.0041

产品属性

Lead Count (#)256
Pb (Lead) FreeYes
Carrier TypeTray
Moisture Sensitivity Level (MSL)3
Country of AssemblyTAIWAN
Country of Wafer FabricationTAIWAN, UNITED STATES
ArchitectureDual-Port
Bus Width (bits)36
Core Voltage (V)2.5
Density (Kb)36864
FunctionInterrupt, Sleep Mode
I/O Frequency (MHz)133 - 133
I/O Type2.5 V LVTTL, 3.3 V LVTTL
InterfaceSync
Length (mm)17
MOQ18
Organization1024K x 36
Output TypeFlowthrough, Pipelined
Package Area (mm²)289
Pb Free Categorye1 SnAgCu
Pitch (mm)1
Pkg. Dimensions (mm)17.0 x 17.0 x 1.76
Pkg. TypeCABGA
Price (USD)$614.08167
Qty. per Carrier (#)90
Qty. per Reel (#)0
Requires Terms and ConditionsDoes not require acceptance of Terms and Conditions
Tape & ReelNo
Temp. Range (°C)0 to 70°C
Thickness (mm)1.76
Width (mm)17
已发布No

描述

The 70T3509M is a high-speed 1024K x 36-bit synchronous dual-port RAM that has been optimized for applications having unidirectional or bidirectional data flow in bursts. An automatic power-down feature, controlled by the Chip Enable (CE0 and CE1) permits the on-chip circuitry of each port to enter a very low standby power mode. The 70T3509M can support an operating voltage of either 3.3V or 2.5V on one or both ports, controllable by the OPT pins. The power supply for the core of the device (VDD) is at 2.5V.