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3.3V 512K x 18 ZBT Synchronous 3.3V I/O Pipelined SRAM

封装信息

Lead Count (#) 165
Pkg. Code BQG165
Pitch (mm) 1
Pkg. Type CABGA
Pkg. Dimensions (mm) 15.0 x 13.0 x 1.2

环境和出口类别

Pb (Lead) Free Yes
Moisture Sensitivity Level (MSL) 3
ECCN (US) EAR99
HTS (US) 8542.32.0041

产品属性

Lead Count (#) 165
Pb (Lead) Free Yes
Carrier Type Reel
Moisture Sensitivity Level (MSL) 3
Country of Assembly Philippines
Country of Wafer Fabrication Taiwan, United States
Architecture ZBT
Budgetary Price (100u) (USD) 19.04
Budgetary Price (1ku) (USD) 17.68
Budgetary Price (1u) (USD) 20.4
Bus Width (bits) 18
Core Voltage (V) 3.3
Density (Kb) 9216
I/O Frequency (MHz) 1 - 1
I/O Voltage (V) 2.5 - 2.5
Length (mm) 15.0
MOQ 2000
Organization 512K x 18
Output Type Pipelined
Package Area (mm²) 195.0
Pb Free Category e1 SnAgCu
Pitch (mm) 1.0
Pkg. Dimensions (mm) 15.0 x 13.0 x 1.2
Pkg. Type CABGA
Qty. per Carrier (#) 0
Qty. per Reel (#) 2000
Reel Size (in) 13
Requires Terms and Conditions Does not require acceptance of Terms and Conditions
Tape & Reel Yes
Temp. Range (°C) 0 to 70°C
Thickness (mm) 1.2
Width (mm) 13.0

描述

The 71V65803 3.3V CMOS SRAM, organized as 512K X 18, is designed to eliminate dead bus cycles when turning the bus around between reads and writes or writes and reads. Thus, it has been given the name ZBT™, or Zero Bus Turnaround. The 71V65803 contains data I/O, address, and control signal registers. In the burst mode, it can provide four cycles of data for a single address presented to the SRAM.