| CAD 模型: | View CAD Model |
| Pkg. Type: | SOIC |
| Pkg. Code: | PEG28 |
| Lead Count (#): | 28 |
| Pkg. Dimensions (mm): | 17.9 x 8.4 x 2.62 |
| Pitch (mm): | 1.27 |
| Pb (Lead) Free | Yes |
| Moisture Sensitivity Level (MSL) | 3 |
| ECCN (US) | EAR99 |
| HTS (US) | 8542.32.0071 |
| Lead Count (#) | 28 |
| Pb (Lead) Free | Yes |
| Carrier Type | Reel |
| Moisture Sensitivity Level (MSL) | 3 |
| Country of Assembly | TAIWAN |
| Country of Wafer Fabrication | TAIWAN, UNITED STATES |
| Access Time (ns) | 15 |
| Architecture | Uni-directional |
| Bus Width (bits) | 9 |
| Core Voltage (V) | 5 |
| Density (Kb) | 36 |
| Family Name | AsyncFIFO |
| I/O Type | 5.0 V TTL |
| Interface | Asynchronous |
| Length (mm) | 17.9 |
| MOQ | 1000 |
| Organization | 4K x 9 |
| Package Area (mm²) | 150.4 |
| Pb Free Category | e3 Sn |
| Pitch (mm) | 1.27 |
| Pkg. Dimensions (mm) | 17.9 x 8.4 x 2.62 |
| Pkg. Type | SOIC |
| Price (USD) | $22.00653 |
| Qty. per Carrier (#) | 0 |
| Qty. per Reel (#) | 1000 |
| Reel Size (in) | 13 |
| Requires Terms and Conditions | Does not require acceptance of Terms and Conditions |
| Tape & Reel | Yes |
| Temp. Range (°C) | -40 to 85°C |
| Thickness (mm) | 2.62 |
| Width (mm) | 8.4 |
| 已发布 | No |