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瑞萨电子 (Renesas Electronics Corporation)
32K x 18 SuperSync FIFO, 5.0V

封装信息

CAD 模型:View CAD Model
Pkg. Type:TQFP
Pkg. Code:PP64
Lead Count (#):64
Pkg. Dimensions (mm):10.0 x 10.0 x 1.4
Pitch (mm):0.5

环境和出口类别

Pb (Lead) FreeNo
Moisture Sensitivity Level (MSL)3
ECCN (US)
HTS (US)

产品属性

Pkg. TypeTQFP
Lead Count (#)64
Pb (Lead) FreeNo
Carrier TypeTray
ArchitectureUni-directional
Bus Width (bits)18
Core Voltage (V)5
Density (Kb)512
Family NameSuperSync
I/O Frequency (MHz)66 - 66
I/O Type5.0 V TTL
InterfaceSynchronous
Length (mm)10
MOQ80
Moisture Sensitivity Level (MSL)3
Organization32K x 18
Package Area (mm²)100
Pb Free Categorye0
Pitch (mm)0.5
Pkg. Dimensions (mm)10.0 x 10.0 x 1.4
Qty. per Carrier (#)160
Qty. per Reel (#)0
Requires Terms and ConditionsDoes not require acceptance of Terms and Conditions
Tape & ReelNo
Temp. Range (°C)-40 to 85°C
Thickness (mm)1.4
Width (mm)10

描述

The 72275 is a 32K x 18 SuperSync FIFO memory with clocked read and write controls. The Frequency Select pin (FS) has been removed, thus it is no longer necessary to select which of the two clock inputs, RCLK or WCLK, is running at the higher frequency. SuperSync FIFOs are particularly appropriate for networking, video, telecommunications, data communications and other applications that need to buffer large amounts of data