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8K x 36 x 2 Triple-Bus FIFO, 5.0V

封装信息

CAD 模型:View CAD Model
Pkg. Type:TQFP
Pkg. Code:PK128
Lead Count (#):128
Pkg. Dimensions (mm):20.0 x 14.0 x 1.4
Pitch (mm):0.5

环境和出口类别

Pb (Lead) FreeNo
Moisture Sensitivity Level (MSL)3
ECCN (US)
HTS (US)

产品属性

Lead Count (#)128
Pb (Lead) FreeNo
Carrier TypeReel
ArchitectureBi-directional
Bus Width (bits)36
Core Voltage (V)5
Density (Kb)512
Family NameTriple-Bus FIFO
FunctionBus Matching
I/O Frequency (MHz)66 - 66
I/O Type5.0 V TTL
InterfaceSynchronous
Length (mm)20
MOQ1000
Moisture Sensitivity Level (MSL)3
Organization8K x 36 x 2
Package Area (mm²)280
Pb Free Categorye0
Pitch (mm)0.5
Pkg. Dimensions (mm)20.0 x 14.0 x 1.4
Pkg. TypeTQFP
Qty. per Carrier (#)0
Qty. per Reel (#)1000
Reel Size (in)13
Requires Terms and ConditionsDoes not require acceptance of Terms and Conditions
Tape & ReelYes
Temp. Range (°C)0 to 70°C
Thickness (mm)1.4
Width (mm)14
已发布No

描述

The 723676 is a 8K x 36 x 2 Triple Bus sync FIFO memory has two independent dual-port SRAM FIFOs on board each chip that can buffer data between a bidirectional 36-bit bus and two unidirectional 18-bit buses. FIFO data can be read and written using either 18-bit or 9-bit formats with a choice of Big- or Little-Endian configurations. Communication between each port may bypass the FIFOs via two mailbox registers. This device can operate in the IDT Standard mode or the first word fall through mode.