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4K x 18 / 8K x 9 TeraSync FIFO, 2.5V

封装信息

Lead Count (#) 144
Pkg. Code BB144
Pitch (mm) 1
Pkg. Type PBGA
Pkg. Dimensions (mm) 13.0 x 13.0 x 1.76

环境和出口类别

Pb (Lead) Free No
ECCN (US) NLR
HTS (US) 8542320071
Moisture Sensitivity Level (MSL) 3

产品属性

Lead Count (#) 144
Pb (Lead) Free No
Carrier Type Tray
Architecture Uni-directional
Bus Width (bits) 18
Core Voltage (V) 2.5
Density (Kb) 72
Family Name TeraSync
Function Bus Matching, JTAG, Mark & Retransmit
I/O Frequency (MHz) 1 - 1
I/O Type 1.5 V HSTL, 1.8 V HSTL, 2.5 V LVTTL, 3.3 V LVTTL
Interface Synchronous
Length (mm) 13
MOQ 15
Moisture Sensitivity Level (MSL) 3
Organization 4K x 18, 8K x 9
Package Area (mm²) 169.0
Pb Free Category e0
Pitch (mm) 1
Pkg. Dimensions (mm) 13.0 x 13.0 x 1.76
Pkg. Type PBGA
Qty. per Carrier (#) 160
Qty. per Reel (#) 0
Requires Terms and Conditions Does not require acceptance of Terms and Conditions
Tape & Reel No
Temp. Range -40 to 85°C
Thickness (mm) 1.76
Width (mm) 13

描述

The 72T1855 is a 4K x 18 / 8K x 9 TeraSync 2.5V FIFO memory with clocked read and write controls and a flexible Bus-Matching x18/x9 data flow. Bus-Matching TeraSync FIFOs are particularly appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match busses of unequal sizes. There are two possible timing modes of operation with these devices: IDT Standard mode and First Word Fall Through mode.