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256K x 18 / 512K x 9 SuperSync II FIFO, 3.3V

封装信息

CAD 模型:View CAD Model
Pkg. Type:TQFP
Pkg. Code:PN80
Lead Count (#):80
Pkg. Dimensions (mm):14.0 x 14.0 x 1.4
Pitch (mm):0.65

环境和出口类别

Pb (Lead) FreeNo
Moisture Sensitivity Level (MSL)3
ECCN (US)
HTS (US)

产品属性

Lead Count (#)80
Pb (Lead) FreeNo
Carrier TypeReel
Moisture Sensitivity Level (MSL)3
ArchitectureUni-directional
Bus Width (bits)18
Core Voltage (V)3.3
Density (Kb)4096
Family NameSuperSync II
FunctionBus Matching, JTAG
I/O Frequency (MHz)100 - 100
I/O Type3.3 V LVTTL
InterfaceSynchronous
Length (mm)14
MOQ750
Organization256K x 18, 512K x 9
Package Area (mm²)196
Pb Free Categorye0
Pitch (mm)0.65
Pkg. Dimensions (mm)14.0 x 14.0 x 1.4
Pkg. TypeTQFP
Qty. per Carrier (#)0
Qty. per Reel (#)750
Reel Size (in)13
Requires Terms and ConditionsDoes not require acceptance of Terms and Conditions
Tape & ReelYes
Temp. Range (°C)-40 to 85°C
Thickness (mm)1.4
Width (mm)14
已发布No

描述

The 72V2113 512K x 9/256K x 18 SuperSync II FIFO memory has flexible x9/x18 Bus-Matching on both read and write ports. The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated. SuperSync II FIFOs are appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match buses of unequal sizes.