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8K x 18 / 16K x 9 SuperSync II FIFO, 3.3V

封装信息

CAD 模型: View CAD Model
Pkg. Type: CABGA
Pkg. Code: BCG100
Lead Count (#): 100
Pkg. Dimensions (mm): 11.0 x 11.0 x 1.4
Pitch (mm): 1

环境和出口类别

Pb (Lead) Free Yes
Moisture Sensitivity Level (MSL) 3
ECCN (US)
HTS (US)

产品属性

Lead Count (#) 100
Pb (Lead) Free Yes
Carrier Type Tray
Moisture Sensitivity Level (MSL) 3
Architecture Uni-directional
Bus Width (bits) 18
Core Voltage (V) 3.3
Density (Kb) 144
Family Name SuperSync II
Function Bus Matching, JTAG
I/O Frequency (MHz) 133 - 133
I/O Type 3.3 V LVTTL
Interface Synchronous
Length (mm) 11
MOQ 100
Organization 16K x 9, 8K x 18
Package Area (mm²) 121
Pb Free Category e1 SnAgCu
Pitch (mm) 1
Pkg. Dimensions (mm) 11.0 x 11.0 x 1.4
Pkg. Type CABGA
Price (USD) $63.733
Qty. per Carrier (#) 168
Qty. per Reel (#) 0
Requires Terms and Conditions Does not require acceptance of Terms and Conditions
Tape & Reel No
Temp. Range (°C) -40 to 85°C
Thickness (mm) 1.4
Width (mm) 11
已发布 No

描述

The 72V263 16K x 9/8K x 18 SuperSync II FIFO memory has flexible x9/x18 bus-matching on both read and write ports. The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated. SuperSync II FIFOs are appropriate for network, video, telecommunications, data communications, and other applications that need to buffer large amounts of data and match buses of unequal sizes.