跳转到主要内容
瑞萨电子 (Renesas Electronics Corporation)
16K x 18 / 32K x 9 SuperSync II FIFO, 3.3V

封装信息

CAD 模型:View CAD Model
Pkg. Type:CABGA
Pkg. Code:BCG100
Lead Count (#):100
Pkg. Dimensions (mm):11.0 x 11.0 x 1.4
Pitch (mm):1

环境和出口类别

Pb (Lead) FreeYes
Moisture Sensitivity Level (MSL)3
ECCN (US)
HTS (US)

产品属性

Lead Count (#)100
Pb (Lead) FreeYes
Carrier TypeReel
Moisture Sensitivity Level (MSL)3
ArchitectureUni-directional
Bus Width (bits)18
Core Voltage (V)3.3
Density (Kb)288
Family NameSuperSync II
FunctionBus Matching, JTAG
I/O Frequency (MHz)133 - 133
I/O Type3.3 V LVTTL
InterfaceSynchronous
Length (mm)11
MOQ1500
Organization16K x 18, 32K x 9
Package Area (mm²)121
Pb Free Categorye1 SnAgCu
Pitch (mm)1
Pkg. Dimensions (mm)11.0 x 11.0 x 1.4
Pkg. TypeCABGA
Qty. per Carrier (#)0
Qty. per Reel (#)1500
Reel Size (in)13
Requires Terms and ConditionsDoes not require acceptance of Terms and Conditions
Tape & ReelYes
Temp. Range (°C)-40 to 85°C
Thickness (mm)1.4
Width (mm)11

描述

The 72V273 32K x 9/16K x 18 SuperSync II FIFO memory has flexible x9/x18 bus-matching on both read and write ports. The variable clock cycle counting delay associated with the latency period found on previous SuperSync devices has been eliminated. SuperSync II FIFOs are appropriate for network, video, telecommunications, data communications, and other applications that need to buffer large amounts of data and match buses of unequal sizes.