| CAD 模型: | View CAD Model |
| Pkg. Type: | TSSOP |
| Pkg. Code: | PAG48 |
| Lead Count (#): | 48 |
| Pkg. Dimensions (mm): | 12.5 x 6.1 x 1.0 |
| Pitch (mm): | 0.5 |
| Pb (Lead) Free | Yes |
| Moisture Sensitivity Level (MSL) | 1 |
| ECCN (US) | |
| HTS (US) |
| Lead Count (#) | 48 |
| Pb (Lead) Free | Yes |
| Carrier Type | Reel |
| Moisture Sensitivity Level (MSL) | 1 |
| Country of Assembly | Taiwan |
| Country of Wafer Fabrication | Taiwan, United States |
| Bus Width (bits) | 16 |
| Core Voltage (V) | 3.3 |
| Function | Buffer/Driver |
| Length (mm) | 12.5 |
| MOQ | 2000 |
| Package Area (mm²) | 76.3 |
| Pb Free Category | e3 Sn |
| Pitch (mm) | 0.5 |
| Pkg. Dimensions (mm) | 12.5 x 6.1 x 1.0 |
| Pkg. Type | TSSOP |
| Qty. per Carrier (#) | 0 |
| Qty. per Reel (#) | 2000 |
| Reel Size (in) | 13 |
| Requires Terms and Conditions | Does not require acceptance of Terms and Conditions |
| Speed Grade | C |
| Tape & Reel | Yes |
| Temp. Range (°C) | -40 to 85°C |
| Thickness (mm) | 1 |
| Width (mm) | 6.1 |
| 已发布 | No |
The 74FCT163244 16-bit high-speed, low-power buffer/line drivers offer bus/backplane interface capability with improved packing density. The three-state controls operate these devices in a Quad-Nibble, Dual-Byte, or single 16-bit word mode. The inputs can be driven from either 3.3V or 5V devices allowing the use of these devices as translators in a mixed 3.3V/5V supply system. Thus, the 74FCT163244 can be used as buffers to connect 5V components to a 3.3V bus. The device operates at -40 °C to +85 °C.