封装信息
| CAD 模型: | View CAD Model |
| Pkg. Type: | TSSOP |
| Pkg. Code: | PGG16 |
| Lead Count (#): | 16 |
| Pkg. Dimensions (mm): | 5.0 x 4.4 x 1.0 |
| Pitch (mm): | 0.65 |
环境和出口类别
| Moisture Sensitivity Level (MSL) | 1 |
| Pb (Lead) Free | Yes |
| ECCN (US) | EAR99 |
| HTS (US) | 8542.39.0090 |
产品属性
| Lead Count (#) | 16 |
| Carrier Type | Reel |
| Moisture Sensitivity Level (MSL) | 1 |
| Qty. per Carrier (#) | 0 |
| Package Area (mm²) | 22 |
| Pitch (mm) | 0.65 |
| Pkg. Dimensions (mm) | 5.0 x 4.4 x 1.0 |
| Qty. per Reel (#) | 2500 |
| Pb (Lead) Free | Yes |
| Pb Free Category | e3 Sn |
| Temp. Range (°C) | -40 to 85°C |
| Adjustable Phase | No |
| Channels (#) | 1 |
| Core Voltage (V) | 2.5V, 3.3V |
| Divider Value | 2, 4, 8 |
| Function | Divider |
| Input Freq (MHz) | 3200 |
| Input Type | CML, LVDS, LVPECL, SSTL |
| Inputs (#) | 1 |
| Length (mm) | 5 |
| MOQ | 2500 |
| Output Banks (#) | 3 |
| Output Freq Range (MHz) | 3200, 1600, 800 |
| Output Skew (ps) | 50 |
| Output Type | LVPECL |
| Output Voltage (V) | 2.5V, 3.3V |
| Outputs (#) | 3 |
| Pkg. Type | TSSOP |
| Product Category | Clock Dividers, RF Buffers |
| Reel Size (in) | 13 |
| Requires Terms and Conditions | Does not require acceptance of Terms and Conditions |
| Supply Voltage (V) | 2.5 - 2.5, 3.3 - 3.3 |
| Tape & Reel | Yes |
| Thickness (mm) | 1 |
| Width (mm) | 4.4 |
有关 8S73034I 的资源
描述
The 8S73034I is a high-speed, differential-to- LVPECL clock divider designed for high-performance telecommunication, computing and networking applications. High clock frequency capability and the differential design make the 8S73034I an ideal choice for performance clock distribution networks. The device frequency-divides the input clock by ÷2, ÷4 and ÷8. Each frequency-divided clock signal is output at a separate LVPECL output. The differential input pair can be driven by LVPECL, LVDS, CML and SSTL signals. Single-ended input signals are supported by using the integrated bias voltage generator (VBB). The 8S73034I is optimized for 3.3V and 2.5V power supply voltages and the temperature range of -40 to +85°C. The device is available in space-saving 16-lead TSSOP and SOIC packages.