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概览

描述

The AT25QL641 is a member of our standard class code and data storage solutions designed for low-voltage systems in which program code is shadowed from Flash memory into embedded or external RAM for execution.

The architecture includes standard erase block sizes and a security register for unique device serialization, system-level Electronic Serial Number (ESN) storage, locked key storage, etc.

The AT25QL641 is Quad enabled at the factory and offers a universally compatible pinout and command set, standard block architecture, and continuous read, wrap, and burst modes for XiP.

特性

  • Single 1.7V - 2.0V supply
  • 64Mbit (8 x 8Mbit) Flash memory
    • Serial Peripheral Interface (SPI) and Quad Peripheral Interface (QPI) compatible
    • Supports SPI modes 0 and 3
    • Supports dual-output read and quad I/O program and read
    • Supports QPI program and read
    • 133MHz maximum operating frequency
    • Clock-to-Output (tV1) of 6ns
    • Up to 66MB/s continuous data transfer rate
  • Quad enabled
  • Full chip erase
  • Flexible, optimized erase architecture for code and data storage applications
    • 0.6ms typical Page Program (256 Bytes) time
    • 60ms typical 4kByte Block Erase time
    • 200ms typical 32kByte Block Erase time
    • 350ms typical 64kByte Block Erase time
  • Hardware-controlled locking of Status registers via WP pin
  • 4kbit secured One-Time Programmable (OTP) security register
  • Hardware write protection
  • Serial Flash Discoverable Parameters (SFDP) register
  • Flexible programming
    • Byte/Page program (1 to 256 Bytes)
    • Dual or quad input byte/page program (1 to 256 Bytes)
  • Erase/Program suspend and resume
  • JEDEC standard manufacturer and device ID read methodology
  • Low power dissipation
    • 2μA Deep Power-Down (DPD) current (typical)
    • 10μA Standby current (typical)
    • 5mA Active read current (typical)
  • Endurance: 100,000 program/erase cycles (4kB, 32kB, or 64kB blocks)
  • Data Retention: 20 years
  • Industrial temperature range: -40°C to +85°C
  • Industry standard green (Pb/Halide-free/RoHS-compliant) package options
    • 8-pad DFN (6mm x 5mm x 0.6mm)
    • 8-lead 208-mil SOIC
    • 8-ball WLCSP

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