封装信息
| CAD 模型: | View CAD Model |
| Pkg. Type: | DFN |
| Pkg. Code: | |
| Lead Count (#): | |
| Pkg. Dimensions (mm): | 2 x 3 |
| Pitch (mm): | 0.5 |
环境和出口类别
| Moisture Sensitivity Level (MSL) | 1 |
| ECCN (US) | EAR99 |
| HTS (US) | 8542.32.0051 |
| Pb (Lead) Free | Yes |
产品属性
| Sample Catalog | Request Samples |
| Pkg. Type | DFN |
| Carrier Type | Tape & Reel |
| Moisture Sensitivity Level (MSL) | 1 |
| Country of Assembly | TAIWAN |
| Country of Wafer Fabrication | TAIWAN |
| Deep Power Down (µA) | 0.2 |
| Flash by Task | Boot Loader, System Settings |
| Interface | Single, Dual SPI |
| Key Benefit | Low read and power down current |
| Longevity | 2034 1月 |
| MOQ | 5000 |
| Memory Class | FusionHD |
| Memory Density | 1 |
| Operating Voltage Range (V) | 1.65 - 3.6 |
| Pb (Lead) Free | Yes |
| Pitch (mm) | 0.5 |
| Pkg. Dimensions (mm) | 2 x 3 |
| Price (USD) | $1.11348 |
| Qty. per Reel (#) | 5000 |
| Read Current (mA) | 3.5 |
| Speed | 104 MHz |
| Supply Voltage Vcc Range | 1.65-3.6 |
| Temp. Range (°C) | -40 to +85°C |
| 已发布 | Yes |
有关 AT25XE011 的资源
描述
The AT25XE011 is a member of our System Enhancing class of code and data storage solutions. It is designed for all system memory tasks ranging from boot/code shadowing to data logging and includes the 256-byte page Erase feature that enables efficient, lower energy datalogging.