封装信息
| CAD 模型: | View CAD Model |
| Pkg. Type: | PBGA |
| Pkg. Code: | AMG376 |
| Lead Count (#): | 376 |
| Pkg. Dimensions (mm): | 23.0 x 23.0 x 2.03 |
| Pitch (mm): | 1 |
环境和出口类别
| Pb (Lead) Free | Yes |
| Moisture Sensitivity Level (MSL) | 3 |
| ECCN (US) | |
| HTS (US) |
产品属性
| Pkg. Type | PBGA |
| Lead Count (#) | 376 |
| Pb (Lead) Free | Yes |
| Carrier Type | Tray |
| DRAM I/F | SDRAM - 100MHz |
| Length (mm) | 23 |
| MOQ | 300 |
| Moisture Sensitivity Level (MSL) | 3 |
| Package Area (mm²) | 529 |
| Pb Free Category | e1 SnAgCu |
| Pitch (mm) | 1 |
| Pkg. Dimensions (mm) | 23.0 x 23.0 x 2.03 |
| Power Consumption Max (W) | 1.5 |
| Processor Bus | PowerPC (MPC7xx)-100MHz |
| Qty. per Carrier (#) | 60 |
| Qty. per Reel (#) | 0 |
| Requires Terms and Conditions | Does not require acceptance of Terms and Conditions |
| Tape & Reel | No |
| Temp. Range (°C) | -40 to 85°C |
| Thickness (mm) | 2.03 |
| Width (mm) | 23 |
有关 CA91L750 的资源
描述
The PowerPro™ delivers memory control support for PowerPC® processors (MPC750, MPC740) and the IDT PowerPC-to-PCI bus switch, PowerSpan™. The PowerPro is designed to leverage the switched PCI architecture of PowerSpan II in PowerPC applications.