封装信息
| Pitch (mm) | 1.27 |
| Lead Count (#) | 16 |
| Pkg. Type | CFP |
| Pkg. Dimensions (mm) | 10.41 x 6.86 x 0.00 |
| Pkg. Code | KBG |
环境和出口类别
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Pb (Lead) Free | Exempt |
| ECCN (US) | 3A001 |
| HTS (US) |
产品属性
| Pkg. Type | CFP |
| Lead Count (#) | 16 |
| Carrier Type | Tray |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Pitch (mm) | 1.3 |
| Pkg. Dimensions (mm) | 10.4 x 6.9 x 0.00 |
| DLA SMD | 5962R9660501VXC |
| Pb (Lead) Free | Exempt |
| Pb Free Category | Gold Plate over compliant Undercoat-e4 |
| MOQ | 25 |
| Temp. Range | -55 to +125°C |
| DSEE (MeV·cm2/mg) | 75 |
| Length (mm) | 10.4 |
| Qualification Level | QML Class V (space) |
| Rating | Space |
| TID HDR (krad(Si)) | 100 |
| TID LDR (krad(Si)) | ELDRS free |
| Thickness (mm) | 0 |
| Width (mm) | 6.9 |
描述
The CD40174BMS consists of six identical D-Type flip-flops having independent data inputs. The clock and clear inputs are common to all six units. Data is transferred to the Q outputs on the positive-going transition of the clock pulse. All six flip-flops are simultaneously reset by a low level on the CLEAR input. The CD40174BMS is supplied in these 16-lead outline packages: Braze Seal DIP H4T, Frit Seal DIP H1E and Ceramic Flatpack H6W.