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CMOS Hex D-Type Flip-Flop

封装信息

CAD 模型:View CAD Model
Pkg. Type:CFP
Pkg. Code:KBG
Lead Count (#):16
Pkg. Dimensions (mm):10.41 x 6.86 x 0.00
Pitch (mm):1.27

环境和出口类别

Moisture Sensitivity Level (MSL)Not Applicable
Pb (Lead) FreeExempt
ECCN (US)
HTS (US)

产品属性

Pkg. TypeCFP
Lead Count (#)16
Carrier TypeTray
Moisture Sensitivity Level (MSL)Not Applicable
Pitch (mm)1.3
Pkg. Dimensions (mm)10.4 x 6.9 x 0.00
DLA SMD5962R9660501VXC
Pb (Lead) FreeExempt
Pb Free CategoryGold Plate over compliant Undercoat-e4
MOQ25
Temp. Range (°C)-55 to +125°C
DSEE (MeV·cm2/mg)75
Length (mm)10.4
Qualification LevelQML Class V (space)
RatingSpace
TID HDR (krad(Si))100
TID LDR (krad(Si))ELDRS free
Width (mm)6.9

描述

The CD40174BMS consists of six identical D-Type flip-flops having independent data inputs. The clock and clear inputs are common to all six units. Data is transferred to the Q outputs on the positive-going transition of the clock pulse. All six flip-flops are simultaneously reset by a low level on the CLEAR input. The CD40174BMS is supplied in these 16-lead outline packages: Braze Seal DIP H4T, Frit Seal DIP H1E and Ceramic Flatpack H6W.