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瑞萨电子 (Renesas Electronics Corporation)
SmartBond Bluetooth Low Energy 4.2 SoC

封装信息

CAD 模型:View CAD Model
Pkg. Type:WLCSP34
Pkg. Code:
Lead Count (#):
Pkg. Dimensions (mm):2.5 x 2.5 x 0.5
Pitch (mm):0.4

环境和出口类别

Moisture Sensitivity Level (MSL)1
Pb (Lead) FreeYes
RoHS (DA14580-01UNA)下载
ECCN (US)
HTS (US)

产品属性

Carrier TypeTape & Reel
Moisture Sensitivity Level (MSL)1
GPIOs (#)14
Pkg. Dimensions (mm)2.5 x 2.5 x 0.5
Qty. per Reel (#)5000
Pb (Lead) FreeYes
Country of AssemblyTAIWAN
Country of Wafer FabricationTAIWAN
ApplicationBeacon & Proximity, Health & Fitness, HID, Smart Home
CPUM0
Clock Rate (MHz)16
Execute from FLASHNo
Flexible System ClockNo
Hardware Crypto EngineYes
MCU/MPUM0
MOQ5000
Memory Size (OTP) (KB)32
Operating Freq (Max) (MHz)32
Pitch (mm)0.4
Pkg. TypeWLCSP34
Price (USD)$2.77788
RAM (KB)50KB
ROM (KB)84
Recommended for new DesignsNo
Rx current (mA)5.1
SPI (#)1
Sensitivity (dBm) (dBm)-93
Supply Voltage Vcc Range0.9-3.6
Temp. Range (°C)-40 to +85°C
Tx Current (mA)4.8
UART (#)1
Wireless StandardBLE 4.2 Core specification

描述

The DA14580 integrated circuit has a fully integrated radio transceiver and baseband processor for Bluetooth® Low Energy. It can be used as a standalone application processor or as a data pump in hosted systems.

The DA14580 supports a flexible memory architecture for storing Bluetooth profiles and custom application code, which can be updated over the air (OTA). The qualified Bluetooth Low Energy protocol stack is stored in a dedicated ROM. All software runs on the Arm® Cortex®-M0 processor via a simple scheduler.

The Bluetooth Low Energy firmware includes the L2CAP service layer protocols, Security Manager (SM), Attribute Protocol (ATT), the Generic Attribute Profile (GATT) and the Generic Access Profile (GAP). All profiles published by the Bluetooth SIG as well as custom profiles are supported. The transceiver interfaces directly to the antenna and is fully compliant with the Bluetooth 4.2 standard.

The DA14580 has dedicated hardware for the Link Layer implementation of Bluetooth Low Energy and interface controllers for enhanced connectivity capabilities.

Benefits

  • Lowest power, smallest size, lowest system cost
  • Flexible: Products can be upgraded in the field
  • Data retention, even on depleted battery

Packages

  • WLCSP-34 (2.5mm x 2.5mm x 0.5mm)
  • QFN-48 (6.0mm x 6.0mm x 0.9mm)
  • QFN-40 (5.0mm x 5.0mm x 0.9mm)