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SmartBond Bluetooth Low Energy 4.2 SoC

封装信息

Pkg. Dimensions (mm) 2.5 x 2.5 x 0.5
Pitch (mm) 0.4
Pkg. Type WLCSP34

环境和出口类别

Moisture Sensitivity Level (MSL) 1
Pb (Lead) Free Yes
ECCN (US) EAR99
HTS (US) 8542.31.11

产品属性

Carrier Type Tape & Reel
Moisture Sensitivity Level (MSL) 1
GPIOs (#) 14
Pkg. Dimensions (mm) 2.5 x 2.5 x 0.5
Qty. per Reel (#) 5000
Pb (Lead) Free Yes
Country of Assembly Taiwan
Country of Wafer Fabrication Taiwan
Price (USD) | 1ku 2.77788
Application Beacon & Proximity, Health & Fitness, HID, Smart Home
CPU M0
Clock Rate (MHz) 16
Execute from FLASH No
Flexible System Clock No
Hardware Crypto Engine Yes
MCU/MPU M0
MOQ 5000
Memory Size (OTP) (KB) 32
Operating Freq (Max) (MHz) 32
Pitch (mm) 0.4
Pkg. Type WLCSP34
RAM (KB) 50
ROM (KB) 84
Recommended for new Designs No
Rx current (mA) 5.1
SPI (#) 1
Sensitivity (dBm) (dBm) -93
Supply Voltage Vcc Range 0.9-3.6
Temp. Range -40 to +85°C
Tx Current (mA) 4.8
UART (#) 1
Wireless Standard BLE 4.2 Core specification

描述

The DA14580 integrated circuit has a fully integrated radio transceiver and baseband processor for Bluetooth® Low Energy. It can be used as a standalone application processor or as a data pump in hosted systems.

The DA14580 supports a flexible memory architecture for storing Bluetooth profiles and custom application code, which can be updated over the air (OTA). The qualified Bluetooth Low Energy protocol stack is stored in a dedicated ROM. All software runs on the Arm® Cortex®-M0 processor via a simple scheduler.

The Bluetooth Low Energy firmware includes the L2CAP service layer protocols, Security Manager (SM), Attribute Protocol (ATT), the Generic Attribute Profile (GATT) and the Generic Access Profile (GAP). All profiles published by the Bluetooth SIG as well as custom profiles are supported. The transceiver interfaces directly to the antenna and is fully compliant with the Bluetooth 4.2 standard.

The DA14580 has dedicated hardware for the Link Layer implementation of Bluetooth Low Energy and interface controllers for enhanced connectivity capabilities.

Benefits

  • Lowest power, smallest size, lowest system cost
  • Flexible: Products can be upgraded in the field
  • Data retention, even on depleted battery

Packages

  • WLCSP-34 (2.5mm x 2.5mm x 0.5mm)
  • QFN-48 (6.0mm x 6.0mm x 0.9mm)
  • QFN-40 (5.0mm x 5.0mm x 0.9mm)