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特性

  • Complies to the Bluetooth 5 core specification
  • Integrated One-Time-Programmable (OTP) memory
  • 2Mb Flash
  • Extended user RAM (96kB)
  • Low operating voltage (1.8V to 3.6V)
  • I2C and pulse density modulation (PDM) audio interfaces

描述

Connected devices are constantly evolving. New generations appear that are smarter, more full featured and have longer battery lifetimes. To enable this, SmartBond has evolved too. The DA14586 offers designers all the benefits of the industry-leading DA1458x but with even greater flexibility to create more advanced applications from the smallest footprints and power budgets.

As part of the SmartBond family, the DA14586 is one of the smallest, lowest power and most integrated Bluetooth® solutions available. This versatile system-on-chip (SoC) is ideal for adding Bluetooth Low Energy (LE) to products like remote controls, proximity tags, beacons, connected medical devices, and smart home nodes. It supports all Bluetooth developments up to Bluetooth 5. Plus, with 96kB of RAM, the DA14586 has double the memory for user applications of its predecessor to take full advantage of the standard's features. It also includes an integrated microphone interface for voice support at low additional cost. The wide supply voltage range (0.9V – 3.6V) covers a larger choice of energy sources and gives full design flexibility.

SmartBond™ DA14586 combines the benefits of the lowest power, smallest size and lowest system cost Bluetooth Low Energy SoC with an integrated Flash. Furthermore, the DA14586 is pin-to-pin compatible with the DA14585 thereby offering a unique cost down path from Flash to One-Time-Programmable (OTP) memory.

Like all SmartBond solutions, the DA14586 is easy to design-in and supports standalone as well as hosted applications. It is supported by a complete development environment and the SmartSnippets™ software that helps you optimize your software for power consumption.

Benefits

  • Large memory to build complex applications
  • Longest battery life
  • Low system Bill of Materials (BOM)

Packages

  • QFN-40 (5.0mm x 5.0mm x 0.9mm)
  • WLCSP-34 (2.4mm x 2.66mm x 0.39mm)

产品参数

属性
Wireless Standard BLE 5.0 Core specification
Proprietary 2G4 protocol No
CPU M0
Flash Memory (KB) 256
ROM (KB) 128
Memory Size (OTP) (KB) 64
RAM (KB) 96
GPIOs (#) 24
Supply Voltage Vcc Range 0.9-3.3
Integrated DCDC Integrated Buck DC-DC converter
Integrated Battery Charger No
External Rails and Load Capacity none
Tx Current (mA) 3.4
Rx current (mA) 3.7
Output Power Range (dBm) -20 - 0
Sensitivity (dBm) (dBm) -93
Clock Rate (MHz) 16
Flexible System Clock No
Execute from FLASH No
Hardware Crypto Engine Yes
QSPI Interface (#) 0
SPI (#) 1
I2C (#) 1
UART (#) 2
ADC 10-bit x 4-ch
USB Ports (#) 0
LE Data Length Extensions Supported
2Mbps Not Supported
LE Coded PHY (Long Range) Not Supported
Extended Advertising Not Supported
Periodic Advertising Not Supported
AoA Not Supported
AoD Not Supported
GATT Caching Not Supported
Bluetooth® Mesh Not Supported
Temp. Range (°C) -40 to +85°C

封装选项

Pkg. Type Pkg. Dimensions (mm) Lead Count (#) Pitch (mm)
QFN 5 x 5 x 0.9 40 0.45

应用

  • Remote controls
  • Proximity tags and trackers
  • Beacons
  • Connected medical devices
  • Smart home
  • Human interface devices
  • VR controllers
  • Connected sensors
  • Wireless charging

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