封装信息
| CAD 模型: | View CAD Model |
| Pkg. Type: | VFBGA |
| Pkg. Code: | |
| Lead Count (#): | 86 |
| Pkg. Dimensions (mm): | 6 x 6 x 0.82 |
| Pitch (mm): | 0.55 |
环境和出口类别
| Moisture Sensitivity Level (MSL) | 3 |
| Pb (Lead) Free | Yes |
| RoHS (DA14691-00000HQ2) | 下载 |
| ECCN (US) | |
| HTS (US) |
产品属性
| Lead Count (#) | 86 |
| Carrier Type | Tape & Reel |
| Moisture Sensitivity Level (MSL) | 3 |
| Pb (Lead) Free | Yes |
| Temp. Range (°C) | -40 to +85°C |
| Country of Assembly | TAIWAN |
| Country of Wafer Fabrication | TAIWAN |
| 2Mbps | Supported |
| ADC | 10-bit x 8-ch, 14-bit x 8-ch |
| AoA | Supported |
| AoD | TX Supported |
| Application | General purpose connectivity MCU, ATLAS, Asset tracking, Connected health, Proximity tags & trackers, Wireless Ranging (WiRa) |
| Bluetooth® Mesh | Not Supported |
| CPU | M33F |
| Clock Rate (MHz) | 96 |
| Execute from FLASH | Yes |
| Extended Advertising | Supported |
| External Rails and Load Capacity | 3x 1.8V @ 50mA each |
| Flexible System Clock | Yes |
| GATT Caching | Not Supported |
| GPIOs (#) | 44 |
| Hardware Crypto Engine | Yes |
| I2C (#) | 2 |
| Integrated Battery Charger | No |
| Integrated DCDC | SIMO Buck DC-DC converter |
| LE Coded PHY (Long Range) | Not Supported |
| LE Data Length Extensions | Supported |
| Longevity | 2034 一月 |
| MCU/MPU | M33 |
| MOQ | 4000 |
| Memory Size (OTP) (KB) | 4 |
| Operating Freq (Max) (MHz) | 96 |
| Output Power Range (dBm) | -18 - 6 |
| Periodic Advertising | Supported |
| Pitch (mm) | 0.55 |
| Pkg. Dimensions (mm) | 6 x 6 x 0.82 |
| Pkg. Type | VFBGA |
| Price (USD) | $5.166 |
| Proprietary 2G4 protocol | Yes |
| QSPI Interface (#) | 1 |
| Qty. per Reel (#) | 4000 |
| RAM (KB) | 384KB |
| ROM (KB) | 128 |
| Recommended for new Designs | Yes |
| Rx current (mA) | 1.8 |
| SPI (#) | 2 |
| Sensitivity (dBm) (dBm) | -97 |
| Supply Voltage Vcc Range | 2.4-5.75 |
| Tx Current (mA) | 3 |
| UART (#) | 3 |
| USB Ports (#) | 1 |
| Wireless Standard | BLE 5.2 Core specification + optional features |
| 已发布 | Yes |
有关 DA14691 的资源
描述
The SmartBond™ DA1469x family of Bluetooth® Low Energy solutions features advanced multi-core microcontroller units designed for robust wireless connectivity. Building on the success of Renesas' SmartBond line, these units include three additional cores, enhancing processing power, resources, range, and battery life. This expanded capability supports a variety of consumer applications, including high-end fitness trackers, sophisticated smart home devices, and immersive virtual reality game controllers.
Powered by the Arm® Cortex®-M33 processor, the DA1469x products deliver superior processing performance, catering to demanding applications. They also support the latest Bluetooth Low Energy 5.2 protocol and proprietary 2.4GHz deployment, facilitating precise Real-Time Locating Systems (RTLS) and low-latency communications. The inclusion of a Sensor Node Controller (SNC) allows for autonomous sensor data processing, further enhancing device functionality.
The DA1469x family is equipped with a state-of-the-art Power Management Unit that optimizes energy efficiency by selectively activating processing cores only when needed. This integration eliminates the requirement for a separate PMIC, thereby reducing system size and enhancing overall performance.
Benefits
- Supports complex applications while guaranteeing extremely low power consumption
- Software programmable protocol engine ensures end products are future proof
- Enables a rich user experience
- Provides banking-level security for application, data, and communication
- Saves up to $1.28 on BOM vs. existing wireless MCUs
- Saves up to 38mm2 of PCB space (components + routing) vs. existing wireless MCUs