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SmartBond 低功耗蓝牙 5.2 高集成度(包括 USB 充电器)模块

封装信息

CAD 模型:View CAD Model
Pkg. Type:MODULE
Pkg. Code:
Lead Count (#):84
Pkg. Dimensions (mm):15.85 x 20 x 2.5
Pitch (mm):1.5

环境和出口类别

Moisture Sensitivity Level (MSL)3
Pb (Lead) FreeYes
RoHS (DA14695MOD-00F32002)英语日文
ECCN (US)
HTS (US)

产品属性

Pkg. TypeMODULE
Lead Count (#)84
Carrier TypeTape & Reel
Moisture Sensitivity Level (MSL)3
Qty. per Reel (#)700
Pb (Lead) FreeYes
Temp. Range (°C)-40 to +85°C
Country of AssemblyTHAILAND
2MbpsSupported
ADC10-bit x 4-ch, 14-bit x 4-ch
AoASupported
AoDTX Supported
ApplicationRechargeable devices, HMI, ATLAS, Asset tracking, Connected health, Proximity tags & trackers
Bluetooth® MeshNot Supported
CPUM33F
Clock Rate (MHz)96
Execute from FLASHYes
Extended AdvertisingSupported
External Rails and Load Capacity1x 3V @ 150mA, 3x 1.8V @ 50mA each
Flash Memory (KB)4096
Flexible System ClockYes
GATT CachingNot Supported
GPIOs (#)40
Hardware Crypto EngineYes
I2C (#)2
Integrated Battery ChargerYes, 560mA JEITA compliant charger
Integrated DCDCSIMO Buck DC-DC converter
LE Coded PHY (Long Range)Not Supported
LE Data Length ExtensionsSupported
MCU/MPUM33
MOQ700
Memory Size (OTP) (KB)4
Operating Freq (Max) (MHz)96
Output Power Range (dBm)-18 - 6
Periodic AdvertisingSupported
Pitch (mm)1.5
Pkg. Dimensions (mm)15.85 x 20 x 2.5
Price (USD)$12.02507
Proprietary 2G4 protocolYes
QSPI Interface (#)1
RAM (KB)512KB
ROM (KB)128
Recommended for new DesignsYes
Rx current (mA)1.8
SPI (#)2
Sensitivity (dBm) (dBm)-96
Supply Voltage Vcc Range2.4-5.75
Tx Current (mA)3
UART (#)3
USB Ports (#)1
Wireless StandardBLE 5.2 Core specification + optional features

描述

DA14695 模块以 SmartBond™ DA14695 低功耗 (LE) 蓝牙 5.2 片上系统 (SoC)为基础构建,提供 DA14695 所有硬件特性和功能。 该模块集成了所有无源器件、天线和 一个 32Mbit QSPI 闪存,配有简单易用的软件。 DA14695 模块可满足广泛的市场用途,可以通过各地区认证,大幅降低开发成本与风险,缩短上市时间。