封装信息
| CAD 模型: | View CAD Model |
| Pkg. Type: | 32-WLCSP |
| Pkg. Code: | |
| Lead Count (#): | |
| Pkg. Dimensions (mm): | 4.56 x 1.98 |
| Pitch (mm): | 0.55 |
环境和出口类别
| Moisture Sensitivity Level (MSL) | 1 |
| Pb (Lead) Free | Yes |
| ECCN (US) | EAR99 |
| HTS (US) | 8542.39.0090 |
产品属性
| Carrier Type | Tape & Reel |
| Moisture Sensitivity Level (MSL) | 1 |
| Pb (Lead) Free | Yes |
| Country of Assembly | TAIWAN |
| Country of Wafer Fabrication | TAIWAN |
| ADC SNR A-weighted support(dB) @ 48kHz | 105 @ 1.8V |
| Advanced Features | 5bd EQ, 3bd Sidetone, ALC, Noise gate, Beep generator |
| Audio Interface | 2-wire |
| DAC SNR A-weighted support(dB) @ 48kHz | 110 @ 1.8V |
| Headphone Power Output | 2 x 57mW @ 2.5V |
| MOQ | 7500 |
| Pitch (mm) | 0.55 |
| Pkg. Dimensions (mm) | 4.56 x 1.98 |
| Pkg. Type | 32-WLCSP |
| Power Consumption During Playback | 4mW @ 1.8V |
| Power Consumption During Record | 2.5mW @ 1.8V |
| Price (USD) | $2.45564 |
| Qty. per Reel (#) | 7500 |
| Temp. Range (°C) | -40 to +85°C |
有关 DA7217 的资源
描述
The DA7217 is a high-performance, low power audio codec optimized for use in headsets or wearable devices. It has differential headphone outputs for use inside headset devices, offering excellent left to right channel separation and common mode noise rejection. DA7217 also has a stereo DAC to headphone output path and ultra-low power operating modes to support always-on audio detect applications.
DA7217 contains two analog microphone input paths, or up to four digital microphone input paths, or a combination of both. The other chip in this family, the DA7218, has single-ended headphone outputs, and has been designed with headphone detect for use in accessories.
Benefits
- Superior hi-fidelity audio performance for immersive record and playback
- Sub 500µW always-on power extends battery life for audio activity detection
- Flexible programming filtering (sideband, voice) enhances voice and audio playback
- Mixed sample rate support for wideband applications
- Supports the latest generation of low power analog and digital microphones
- Small package footprint with an optimized ballout conducive to low cost PCB manufacturing