特性
- Integrated MOSFETs
- 6A continuous output current
- Up to 96% efficiency
- Multiple supply start-up tracking
- Built-in ±5% voltage margining
- 3V to 6V input voltage
- 0.72 in2 footprint with components on one side of PCB
- Adjustable switching frequency to 1MHz
- Oscillator synchronization possible
- 100% duty ratio
- Junction temperature indicator
- Over-temperature protection
- Internal soft-start
- Variable output voltage down to 0.8V
- Power-good indicator
- 28 Ld HTSSOP package
- Pb-free plus anneal available (RoHS compliant)
EL7566 Functional Diagram
描述
The EL7566 is a full-feature synchronous step-down regulator capable of up to 6A and 96% efficiency. The device operates from 3V to 6V input supply (VIN). With internal CMOS power FETs, the device can operate at up to 100% duty ratio, allowing for an output voltage range of 0.8V to nearly VIN. An adjustable switching frequency up to 1MHz enables the use of small components, thereby reducing board area consumption to under 0.72sq-in on one side of a PCB. The EL7566 operates in constant frequency PWM mode, making external synchronization possible. A soft-start feature is integrated in the EL7566 to limit in-rush currents and allow for a smooth voltage ramp from zero to regulation. Other start-up features are integrated to add flexibility for synchronizing many supplies in multiple configurations. The EL7566 also offers a voltage margining capability that shifts the output voltage ±5% for validation of system card performance and reliability during manufacturing tests. A junction temperature indicator conveniently monitors the silicon die temperature, saving time in thermal characterization. An easy-to-use simulation tool is available for download and can be used to modify design parameters such as switching frequency, voltage ripple, ambient temperature, as well as view schematics waveforms, efficiency graphs, and complete BOM with Gerber layout.
应用
- Point-of-regulation power supplies
- FPGA Core and I/O supplies
- DSP, CPU Core, and IO supplies
- Logic/Bus supplies
- Portable equipment
| Part Number | Status | Samples | Stock | RoHS | Package | Carrier Type |
|---|---|---|---|---|---|---|
| EL7566DREZ | Obsolete | N/A | Out of Stock | RoHS:EN | TSSOP-EP | Tube |
| EL7566DREZ-T13 | Obsolete | N/A | Out of Stock | RoHS:EN | TSSOP-EP | Reel |
| EL7566DREZ-T7 | Obsolete | N/A | Out of Stock | RoHS:EN | TSSOP-EP | Reel |
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- 应用说明英语PDF 592 KB an9208 2018年2月01日AI 生成的摘要: The document discusses high frequency power converters, focusing on ZVS-QRC and multi-resonant topologies that reduce switching losses by operating switches at zero voltage. It highlights challenges like EMI and high voltage stress. The SEPIC converter is introduced, explaining its ability to buck or boost voltage without polarity inversion. The document details SEPIC’s operating modes, voltage-current relationships, and the importance of inductor values for continuous or discontinuous conduction modes.
- 产品变更通告英语PDF 133 KB PCN13032 2013年4月16日
- 产品变更通告英语PDF 98 KB PCN12094 2012年12月19日
- 应用说明英语PDF 397 KB an1684 2004年1月19日AI 生成的摘要: The document outlines important legal disclaimers and usage guidelines for semiconductor products. It emphasizes user responsibility for product design and safety, disclaims liability for damages, and clarifies no intellectual property licenses are granted. Products are categorized by quality grades with specific application recommendations. Users must comply with laws, avoid unauthorized modifications, and ensure safe use within specified conditions. Contact details for Renesas Electronics sales offices worldwide are provided.
- 应用说明英语PDF 509 KB an1681 2004年1月19日AI 生成的摘要: The document explains grounding techniques for PCB layouts using a dual op amp example on a single-layer copper board. It compares three grounding schemes: a center spine ground trace, an outer ground plane, and a split/star ground plane, highlighting the benefits of single-point grounding to minimize noise and antenna effects. It emphasizes following current paths, minimizing loop lengths, and ensuring close forward and return paths to reduce interference. The document also includes disclaimers on product use, quality grades, safety, and legal compliance.
- 应用说明英语PDF 1.56 MB an1209 2004年1月19日AI 生成的摘要: The document details Intersil Integrated FET DC/DC converters, highlighting various models with their voltage ranges, output currents, switching frequencies, and package types. It explains the simplified buck regulator schematic, emphasizing ease of design with only four external components and internal FETs optimized for performance. Features include synchronous rectification for high efficiency, ceramic capacitor compatibility, small form factor, improved thermal performance, 100% duty cycle operation, internal loop compensation, external frequency synchronization for EMI reduction, and advanced control functions like UVLO, overcurrent, and thermal protection.
- 应用说明英语PDF 236 KB an1108 2003年4月15日AI 生成的摘要: This document outlines important legal disclaimers and usage guidelines for semiconductor products. It emphasizes user responsibility for product design, liability disclaimers by Renesas Electronics, restrictions on modification and reverse engineering, and classification of product quality grades. It also highlights safety requirements, compliance with laws and regulations, and the necessity to consult the latest product information. Contact details for Renesas Electronics sales offices worldwide are provided.
- 应用说明英语PDF 817 KB an1101 2003年4月15日AI 生成的摘要: The document details the design of a high-efficiency DC-DC converter using the EL75XX series. It explains the pin functions, including charge pump capacitors, voltage doubler input, ground connections, and control signals. The basic buck regulator topology is described, showing how the output voltage depends on input voltage and duty cycle. It also covers synchronized rectification, replacing diodes with low-resistance FETs to improve efficiency and reduce power loss, with the addition of a Schottky diode to enhance reliability during transient states.
- 应用说明英语PDF 453 KB an1096 2003年4月15日AI 生成的摘要: The document details thermal design considerations for the EL75XX series, focusing on the 28 PSOP 2 package. It explains two versions of the package—slug down and slug up—with different mounting and heat dissipation options. Various heatsink configurations, bonding materials, and forced air convection methods improve thermal performance, enabling power dissipation from 2W up to 9W. Thermal resistance values and the effects of airflow on heat dissipation are analyzed with graphical data.
- 应用说明英语PDF 650 KB an9210 2001年12月21日AI 生成的摘要: This document presents a new PSPICE subcircuit model for power MOSFETs with global temperature options. It details synchronous rectifier circuit operation, including gate biasing and conduction modes. The model accurately simulates switching waveforms, diode recovery, and temperature-dependent efficiency. Measured and modeled data show excellent correlation for output characteristics, threshold voltage, breakdown voltage, and on-resistance across temperature ranges. Limitations in linear mode modeling are noted due to PSPICE assumptions.
- 应用说明英语PDF 387 KB an9209 1998年8月13日AI 生成的摘要: The document presents an empirical SPICE-2 subcircuit model for power MOSFETs, accurately simulating static and dynamic behaviors including first and third-quadrant operations and avalanche breakdown. The model aligns closely with measured data and is compatible with all SPICE versions without code modification. It uses parameters derived from datasheets or simple measurements. The document also includes detailed comparisons of measured and calculated curves for transfer, output, switching, and diode recovery characteristics. Additionally, it provides legal and usage disclaimers from Renesas Electronics.
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- 应用说明英语PDF 592 KB an9208 2018年2月01日AI 生成的摘要: The document discusses high frequency power converters, focusing on ZVS-QRC and multi-resonant topologies that reduce switching losses by operating switches at zero voltage. It highlights challenges like EMI and high voltage stress. The SEPIC converter is introduced, explaining its ability to buck or boost voltage without polarity inversion. The document details SEPIC’s operating modes, voltage-current relationships, and the importance of inductor values for continuous or discontinuous conduction modes.
- 应用说明英语PDF 397 KB an1684 2004年1月19日AI 生成的摘要: The document outlines important legal disclaimers and usage guidelines for semiconductor products. It emphasizes user responsibility for product design and safety, disclaims liability for damages, and clarifies no intellectual property licenses are granted. Products are categorized by quality grades with specific application recommendations. Users must comply with laws, avoid unauthorized modifications, and ensure safe use within specified conditions. Contact details for Renesas Electronics sales offices worldwide are provided.
- 应用说明英语PDF 509 KB an1681 2004年1月19日AI 生成的摘要: The document explains grounding techniques for PCB layouts using a dual op amp example on a single-layer copper board. It compares three grounding schemes: a center spine ground trace, an outer ground plane, and a split/star ground plane, highlighting the benefits of single-point grounding to minimize noise and antenna effects. It emphasizes following current paths, minimizing loop lengths, and ensuring close forward and return paths to reduce interference. The document also includes disclaimers on product use, quality grades, safety, and legal compliance.
- 应用说明英语PDF 1.56 MB an1209 2004年1月19日AI 生成的摘要: The document details Intersil Integrated FET DC/DC converters, highlighting various models with their voltage ranges, output currents, switching frequencies, and package types. It explains the simplified buck regulator schematic, emphasizing ease of design with only four external components and internal FETs optimized for performance. Features include synchronous rectification for high efficiency, ceramic capacitor compatibility, small form factor, improved thermal performance, 100% duty cycle operation, internal loop compensation, external frequency synchronization for EMI reduction, and advanced control functions like UVLO, overcurrent, and thermal protection.
- 应用说明英语PDF 236 KB an1108 2003年4月15日AI 生成的摘要: This document outlines important legal disclaimers and usage guidelines for semiconductor products. It emphasizes user responsibility for product design, liability disclaimers by Renesas Electronics, restrictions on modification and reverse engineering, and classification of product quality grades. It also highlights safety requirements, compliance with laws and regulations, and the necessity to consult the latest product information. Contact details for Renesas Electronics sales offices worldwide are provided.查看更多 (10)
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- 产品变更通告英语PDF 133 KB PCN13032 2013年4月16日
- 产品变更通告英语PDF 98 KB PCN12094 2012年12月19日
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