封装信息
| CAD 模型: | View CAD Model |
| Pkg. Type: | QFP |
| Pkg. Code: | pkg_74 |
| Lead Count (#): | 80 |
| Pkg. Dimensions (mm): | 14 x 14 x 3.05 |
| Pitch (mm): | 0.65 |
环境和出口类别
| Moisture Sensitivity Level (MSL) | 3 |
| Pb (Lead) Free | Yes |
| ECCN (US) | |
| HTS (US) |
产品属性
| PLP terminated | 2024 Jan (terminated) |
| CPU | H8/300H |
| Bit Size | 16 |
| RAM (KB) | 2 |
| Program Memory (KB) | 48 |
| Operating Freq (Max) (MHz) | 10 |
| Lead Count (#) | 80 |
| Timer | 16-bit x 4-ch |
| ADC | 10-bit x 8-ch |
| Ethernet | No |
| LVD or PVD | No |
| DMA | No |
| Temp. Range (°C) | -20 to +75 |
| Moisture Sensitivity Level (MSL) | 3 |
| Family Name | H8 |
| Lead Compliant | Yes |
| Length (mm) | 14 |
| MOQ | 1 |
| Pb (Lead) Free | Yes |
| Pkg. Dimensions (mm) | 14 x 14 x 3.05 |
| Pkg. Type | QFP |
| RTC | No |
| Tape & Reel | No |
| Thickness (mm) | 3.05 |
| Width (mm) | 14 |
有关 H8/38076R 的资源
描述
The H8/38076R Group is supported only for customers who have already adopted these products. The RX113 or RL78/L13, RL78/L1C Groups are recommended for new designs.