封装信息
| CAD 模型: | View CAD Model |
| Pkg. Type: | TFQFP |
| Pkg. Code: | pkg_130 |
| Lead Count (#): | 100 |
| Pkg. Dimensions (mm): | 12 x 12 x 1.2 |
| Pitch (mm): | 0.4 |
环境和出口类别
| Pb (Lead) Free | |
| Moisture Sensitivity Level (MSL) | |
| ECCN (US) | |
| HTS (US) |
产品属性
| CPU | H8/300L |
| Bit Size | 8 |
| RAM (KB) | 1 |
| Program Memory (KB) | 16 |
| Operating Freq (Max) (MHz) | 5 |
| Lead Count (#) | 100 |
| Timer | 8-bit x 3-ch, 16-bit x 1-ch |
| ADC | 8-bit x 4-ch |
| CAN (ch) | 0 |
| Ethernet | No |
| LVD or PVD | No |
| DMA | No |
| Temp. Range (°C) | -20 to +75°C |
| Family Name | H8 |
| Length (mm) | 12 |
| Pkg. Dimensions (mm) | 12 x 12 x 1.2 |
| RTC | No |
| Width (mm) | 12 |
有关 H8/3854 的资源
描述
The H8/3854 Group is supported only for the customers who have already adopted any of the products. For new adoption, please consider other products such as RL78/L13, RL78/L1C, RX113 Group.