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瑞萨电子 (Renesas Electronics Corporation)
Microcontrollers for Mobile Device Applications

封装信息

CAD 模型:View CAD Model
Pkg. Type:LQFP
Pkg. Code:pkg_104
Lead Count (#):64
Pkg. Dimensions (mm):10 x 10 x 1.7
Pitch (mm):0.5

环境和出口类别

Moisture Sensitivity Level (MSL)3
RoHS (DF2210CUFP24V)英语日文
Pb (Lead) FreeYes
ECCN (US)
HTS (US)

产品属性

PLP terminated2024 Jan (terminated)
CPUH8S/2000
Bit Size16
RAM (KB)8
Program Memory (KB)32
Lead Count (#)64
Operating Freq (Max) (MHz)24
Timer16-bit x 3-ch
ADC10-bit x 6-ch
RTCYes
LVD or PVDNo
DMANo
EthernetNo
USBUSB Peripheral
Temp. Range (°C)-20 to +75
Moisture Sensitivity Level (MSL)3
Family NameH8S
Lead CompliantYes
Length (mm)10
MOQ1
Pb (Lead) FreeYes
Pkg. Dimensions (mm)10 x 10 x 1.7
Pkg. TypeLQFP
Tape & ReelNo
Thickness (mm)1.7
Width (mm)10

描述

The H8S/2212 Group is supported only for customers who have already adopted these products. The RX231, RX651 Groups are recommended for new designs.