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Microcontrollers for Mobile Device Applications (Non Promotion)

封装信息

CAD 模型:View CAD Model
Pkg. Type:LFBGA
Pkg. Code:pkg_723
Lead Count (#):112
Pkg. Dimensions (mm):10 x 10 x 1.4
Pitch (mm):0.8

环境和出口类别

Moisture Sensitivity Level (MSL)
RoHS (DF2215TBR24WV)英语日文
Pb (Lead) FreeYes
ECCN (US)
HTS (US)

产品属性

CPUH8S/2000
Bit Size16
RAM (KB)20
Program Memory (KB)256
Lead Count (#)112
Operating Freq (Max) (MHz)24
Timer8-bit x 2-ch, 16-bit x 3-ch
ADC10-bit x 6-ch
DAC8-bit x 2-ch
RTCNo
LVD or PVDNo
DMANo
EthernetNo
USBUSB Peripheral
Temp. Range (°C)-40 to +85
Family NameH8S
Lead CompliantYes
Length (mm)10
MOQ1
Pb (Lead) FreeYes
Pkg. Dimensions (mm)10 x 10 x 1.4
Pkg. TypeLFBGA
Tape & ReelNo
Thickness (mm)1.4
Width (mm)10

描述

The H8S/2215 Group is supported only for customers who have already adopted these products. The RX651 Group is recommended for new designs.