封装信息
| CAD 模型: | View CAD Model |
| Pkg. Type: | QFP |
| Pkg. Code: | pkg_775 |
| Lead Count (#): | 100 |
| Pkg. Dimensions (mm): | 20 x 14 x 3.1 |
| Pitch (mm): | 0.65 |
环境和出口类别
| RoHS (D72237F10V) | 英语日文 |
| Moisture Sensitivity Level (MSL) | |
| Pb (Lead) Free | Yes |
| ECCN (US) | |
| HTS (US) |
产品属性
| CPU | H8S/2000 |
| Bit Size | 16 |
| RAM (KB) | 16 |
| Program Memory (KB) | 128 |
| Lead Count (#) | 100 |
| Operating Freq (Max) (MHz) | 13.5 |
| Timer | 8-bit x 2-ch, 16-bit x 6-ch |
| ADC | 10-bit x 8-ch |
| DAC | 8-bit x 2-ch |
| RTC | Yes |
| LVD or PVD | No |
| DMA | No |
| Ethernet | No |
| Temp. Range (°C) | -20 to +75 |
| Carrier Type | Tray |
| Family Name | H8S |
| Lead Compliant | Yes |
| Length (mm) | 20 |
| MOQ | 1 |
| Pb (Lead) Free | Yes |
| Pkg. Dimensions (mm) | 20 x 14 x 3.1 |
| Pkg. Type | QFP |
| Tape & Reel | No |
| Thickness (mm) | 3.1 |
| Width (mm) | 14 |
有关 H8S/2237 的资源
描述
The H8S/2237 Group is supported only for customers who have already adopted these products. The RX230 is recommended for new designs.