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瑞萨电子 (Renesas Electronics Corporation)
Microcontrollers for Mobile Device Applications (Non Promotion)

封装信息

CAD 模型:View CAD Model
Pkg. Type:
Pkg. Code:
Lead Count (#):
Pkg. Dimensions (mm):
Pitch (mm):

环境和出口类别

Pb (Lead) Free
Moisture Sensitivity Level (MSL)
ECCN (US)
HTS (US)

产品属性

描述

The H8S/2258, 2239, 2238, 2237, 2227 Group is supported only for customers who have already adopted these products. The RX230 is recommended for new designs.