封装信息
| Pkg. Type: | FQFP |
| Pkg. Code: | pkg_771 |
| Lead Count (#): | 144 |
| Pkg. Dimensions (mm): | 20 x 20 x 3.05 |
| Pitch (mm): | 0.5 |
环境和出口类别
| Pb (Lead) Free | |
| Moisture Sensitivity Level (MSL) | |
| ECCN (US) | |
| HTS (US) |
产品属性
| CPU | H8S/2600 |
| Bit Size | 16 |
| RAM (KB) | 8 |
| Program Memory (KB) | 256 |
| Lead Count (#) | 144 |
| Operating Freq (Max) (MHz) | 20 |
| Timer | 16-bit x 6-ch |
| ADC | 10-bit x 16-ch |
| RTC | Yes |
| LVD or PVD | No |
| DMA | No |
| Ethernet | No |
| CAN (ch) | 1 |
| Temp. Range (°C) | -40 to +105°C |
| Family Name | H8S |
| Length (mm) | 20 |
| Pkg. Dimensions (mm) | 20 x 20 x 3.05 |
| Width (mm) | 20 |
有关 H8S/2649 的资源
描述
The H8S/2649 Group is supported only for customers who have already adopted these products. The RX63T Group is recommended for new designs.