封装信息
| CAD 模型: | View CAD Model |
| Pkg. Type: | SOP |
| Pkg. Code: | pkg_10175 |
| Lead Count (#): | 8 |
| Pkg. Dimensions (mm): | 5 x 4 x 1.73 |
| Pitch (mm): |
环境和出口类别
| Moisture Sensitivity Level (MSL) | 1 |
| RoHS (HN58X25256FPIAG#S0) | 英语日文 |
| Pb (Lead) Free | Yes |
| ECCN (US) | |
| HTS (US) |
产品属性
| Carrier Type | Embossed Tape |
| Moisture Sensitivity Level (MSL) | 1 |
| Country of Assembly | JAPAN, VIETNAM |
| Country of Wafer Fabrication | JAPAN |
| Application | Industrial |
| Clock frequency (kHz) | 5000 |
| Family Name | Serial EEPROM |
| Interface | SPI bus |
| Lead Compliant | Yes |
| Lead Count (#) | 8 |
| Length (mm) | 5 |
| MOQ | 2500 |
| Memory Capacity (kbit) | 256 |
| Organization (bit) | x 8 |
| Pb (Lead) Free | Yes |
| Pkg. Dimensions (mm) | 5 x 4 x 1.73 |
| Pkg. Type | SOP |
| Price (USD) | $4.57071 |
| Replacement Remark | Difficulty in maintaining stable and continuous supply due to aging manufacturing equipment. |
| Supply Voltage (V) | 1.8 - 5.5 |
| Tape & Reel | No |
| Thickness (mm) | 1.73 |
| Width (mm) | 4 |
有关 HN58X25256 的资源
描述
HN58X25128/HN58X25256 Series is the Serial Peripheral Interface compatible (SPI) EEPROM (Electrically Erasable and Programmable ROM). It realizes high-speed, low-power consumption, and a high level of reliability by employing advanced MONOS memory technology and the CMOS process and low voltage circuitry technology. It also has a 64-byte page programming function to make its write operation faster.