跳转到主要内容

特性

  • Electrically screened to DLA SMD # 5962-99558
  • QML qualified per MIL-PRF-38535 Requirements
  • Radiation environment
  • Maximum total dose: 300 krad(SI)
  • Vertical architecture provides low dose rate immunity
  • DI RSG process provides latch-up immunity
  • Low start-up current: 100µA (Typical)
  • Fast propagation delay: 80ns (Typical)
  • 12V to 30V operation
  • 1A (peak) dual output drive capability
  • 5.1V reference
  • Undervoltage lockout
  • Programmable soft-start
  • Switching frequencies to 500kHz
  • Latched overcurrent comparator with full cycle restart
  • Programmable leading edge blanking circuit

描述

The radiation hardened HS-1825ARH, HS-1825AEH pulse width modulator is designed to be used in high-frequency switched-mode power supplies and can be used in either current-mode or voltage-mode. It is well suited for single-ended boost converter applications. Device features include a precision voltage reference, low power start-up circuit, high-frequency oscillator, wide-band error amplifier and fast current-limit comparator. The use of proprietary process capabilities and unique design techniques results in fast propagation delay times and high output current over a wide range of output voltages. Constructed with the Intersil radiation hardened Silicon Gate (RSG) Dielectric Isolation BiCMOS process, the HS-1825ARH, HS-1825AEH have been specifically designed to provide highly reliable performance when exposed to harsh radiation environments..

产品参数

属性
Rating Space
Control Mode Voltage, Peak Current Mode
Phases (Max) 2
No-Load Operating Current 25
Quiescent Current 55µA
Supply Voltage (min) (V) 12 - 12
Supply Voltage (max) (V) 30 - 30
Switching Frequency (min) (kHz) 10
Switching Frequency (max) (kHz) 3000
Topology Boost, Flyback, Forward, Full Bridge, Half Bridge, Push-Pull
VREF (V) 5.1
Temp. Range (°C) -55 to +125°C
TID HDR (krad(Si)) 300
TID LDR (krad(Si)) 50
DSEE (MeV·cm2/mg) 86.3
Flow RH Hermetic
Qualification Level Class V
Die Sale Availability? Yes
PROTO Availability? Yes

封装选项

Pkg. Type Pkg. Dimensions (mm) Lead Count (#) Pitch (mm)
CFP 10.4 x 6.9 x 0.00 16 1.3
DIE
SBDIP 20.3 x 7.5 x 2.41 16 2.5

应用

  • Current or voltage mode switching power supplies
  • Motor speed and direction control

当前筛选条件