封装信息
| Pitch (mm) | 1.27 |
| Lead Count (#) | 16 |
| Pkg. Type | CFP |
| Pkg. Dimensions (mm) | 10.41 x 6.86 x 0.00 |
| Pkg. Code | KBV |
环境和出口类别
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Pb (Lead) Free | Exempt |
| ECCN (US) | 9A515 |
| HTS (US) |
产品属性
| Pkg. Type | CFP |
| Lead Count (#) | 16 |
| Carrier Type | Tray |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Pitch (mm) | 1.3 |
| Pkg. Dimensions (mm) | 10.4 x 6.9 x 0.00 |
| Pb (Lead) Free | Exempt |
| Pb Free Category | Gold Plate over compliant Undercoat-e4 |
| MOQ | 1 |
| Temp. Range | -55 to +125°C |
| CAGE code | 34371 |
| Control Mode | Voltage, Peak Current Mode |
| Die Sale Availability? | Yes |
| Duty Cycle (Max) (%) | 50 |
| Flow | RH Hermetic |
| Length (mm) | 10.4 |
| Models Available | iSIM |
| No-Load Operating Current | 25 |
| Operating Freq (Max) (MHz) | 0.5 |
| PROTO Availability? | Yes |
| Phase of Outputs | Out of Phase |
| Phases (Max) | 2 |
| Qualification Level | EM |
| Quiescent Current | 55µA |
| Rating | Space |
| SMD URL | |
| Supply Voltage (max) (V) | 30 - 30 |
| Supply Voltage (min) (V) | 12 - 12 |
| Switching Frequency (max) (kHz) | 3000 |
| Switching Frequency (min) (kHz) | 10 |
| TID HDR (krad(Si)) | 300 |
| Thickness (mm) | 0 |
| Topology | Boost, Flyback, Forward, Full Bridge, Half Bridge, Push-Pull |
| UVLO Rising (V) | 8.4 |
| VDD1 (V) | 12 - 30 |
| VREF (V) | 5.1 |
| Width (mm) | 6.9 |
描述
The radiation hardened HS-1825ARH, HS-1825AEH pulse width modulator is designed to be used in high-frequency switched-mode power supplies and can be used in either current-mode or voltage-mode. It is well suited for single-ended boost converter applications. Device features include a precision voltage reference, low power start-up circuit, high-frequency oscillator, wide-band error amplifier and fast current-limit comparator. The use of proprietary process capabilities and unique design techniques results in fast propagation delay times and high output current over a wide range of output voltages. Constructed with the Intersil radiation hardened Silicon Gate (RSG) Dielectric Isolation BiCMOS process, the HS-1825ARH, HS-1825AEH have been specifically designed to provide highly reliable performance when exposed to harsh radiation environments.