封装信息
| Pitch (mm) | 2.54 |
| Lead Count (#) | 28 |
| Pkg. Type | SBDIP |
| Pkg. Dimensions (mm) | 35.56 x 15.11 x 2.41 |
| Pkg. Code | DKP |
环境和出口类别
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Pb (Lead) Free | Yes |
| ECCN (US) | 9A515.e.1 |
| HTS (US) | 8542.32.0071 |
| RoHS (HS1-6664RH-T) | 英语日文 |
产品属性
| Pkg. Type | SBDIP |
| Lead Count (#) | 28 |
| Carrier Type | Tube |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Pitch (mm) | 2.5 |
| Pkg. Dimensions (mm) | 35.6 x 15.1 x 2.41 |
| DLA SMD | 5962R9562601TXC |
| Pb (Lead) Free | Yes |
| Pb Free Category | Gold Plate over compliant Undercoat-e4 |
| MOQ | 450 |
| Temp. Range | -55 to +125°C |
| CAGE code | 34371 |
| Lead Compliant | No |
| Length (mm) | 35.6 |
| Qualification Level | QML Class T (space lower level) |
| Rating | Space |
| TID HDR (krad(Si)) | 100 |
| Tape & Reel | No |
| Thickness (mm) | 2.41 |
| Width (mm) | 15.1 |
有关 HS-6664RH-T 的资源
描述
The Intersil Satellite Applications Flow™ (SAF) devices are fully tested and guaranteed to 100kRAD total dose. These QML Class T devices are processed to a standard flow intended to meet the cost and shorter lead-time needs of large volume satellite manufacturers while maintaining a high level of reliability. The Intersil HS-6664RH-T is a radiation hardened 64K CMOS PROM, organized in an 8K word by 8-bit format. The chip is manufactured using a radiation hardened CMOS process and utilizes synchronous circuit design techniques to achieve high-speed performance with very low power dissipation. On-chip address latches are provided, allowing easy interfacing with microprocessors that use a multiplexed address/data bus structure. The output enable control simplifies system interfacing by allowing output data bus control in addition to the chip enable control. All bits are manufactured storing a logical 0 and can be selectively programmed for a logical 1 at any bit location.