封装信息
| Pitch (mm) | 1.27 |
| Lead Count (#) | 28 |
| Pkg. Type | CFP |
| Pkg. Dimensions (mm) | 18.29 x 12.70 x 0.00 |
| Pkg. Code | KBR |
环境和出口类别
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Pb (Lead) Free | Exempt |
| ECCN (US) | 9A515 |
| HTS (US) |
产品属性
| Pkg. Type | CFP |
| Lead Count (#) | 28 |
| Carrier Type | Tray |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Pitch (mm) | 1.3 |
| Pkg. Dimensions (mm) | 18.3 x 12.7 x 0.00 |
| Pb (Lead) Free | Exempt |
| Pb Free Category | Gold Plate over compliant Undercoat-e4 |
| MOQ | 1 |
| Temp. Range | -55 to +125°C |
| CAGE code | 34371 |
| DSEE (MeV·cm2/mg) | 100 |
| Length (mm) | 18.3 |
| Qualification Level | EM |
| Rating | Space |
| TID HDR (krad(Si)) | 300 |
| Thickness (mm) | 0 |
| Width (mm) | 12.7 |
描述
The Intersil HS-6664RH is a radiation hardened 64K CMOS PROM, organized in an 8K word by 8-bit format. The chip is manufactured using a radiation hardened CMOS process, and utilizes synchronous circuit design techniques to achieve high-speed performance with very low power dissipation. On-chip address latches are provided, allowing easy interfacing with microprocessors that use a multiplexed address/data bus structure. The output enable control simplifies system interfacing by allowing output data bus control in addition to the chip enable control. All bits are manufactured storing a logical 0 and can be selectively programmed for a logical 1 at any bit location. Applications for the HS-6664RH CMOS PROM include low-power microprocessor-based instrumentation and communications systems, remote data acquisition and processing systems, and processor control storage. Specifications for Rad Hard QML devices are controlled by the Defense Supply Center in Columbus (DSCC). The SMD numbers listed here must be used when ordering. Detailed Electrical Specifications for these devices are contained in SMD 5962-95626.