封装信息
| CAD 模型: | View CAD Model |
| Pkg. Type: | WAFER |
| Pkg. Code: | DICEW |
| Lead Count (#): | |
| Pkg. Dimensions (mm): | 0.0 x 0.0 x 0.0 |
| Pitch (mm): |
环境和出口类别
| Moisture Sensitivity Level (MSL) | |
| Pb (Lead) Free | Yes |
| ECCN (US) | EAR99 |
| HTS (US) | 8542.39.0090 |
产品属性
| Lead Count (#) | 0 |
| Carrier Type | WFP |
| Pb (Lead) Free | Yes |
| Pb Free Category | e3 Sn |
| Temp. Range (°C) | 0 to 70°C |
| Country of Wafer Fabrication | UNITED STATES |
| Application | CXP-SR10, 100G Ethernet SR10, 168GFDR InfiniBand |
| Channels (#) | 12 |
| Data Rate Max (Gbps) | 16 |
| Function | VCSEL Driver |
| MOQ | 112 |
| Pkg. Dimensions (mm) | 0.0 x 0.0 x 0.0 |
| Pkg. Type | WAFER |
| Price (USD) | $67.9 |
| Qty. per Carrier (#) | 0 |
| Qty. per Reel (#) | 0 |
| Requires Terms and Conditions | Does not require acceptance of Terms and Conditions |
| Tape & Reel | No |
| 已发布 | No |
有关 HXT6112 的资源
描述
The HXT6112 VCSEL driver array is a key component for compact, robust, low-power optical transmitter modules. In conjunction with the VCSEL array, the chip handles the complete digital-to-optical conversion, including CML input, laser driver, drive control, and supervision. Standard silicon technology and a small number of additional components allow for cost-effective and compact assemblies.