封装信息
| CAD 模型: | View CAD Model |
| Pkg. Type: | SOT23 |
| Pkg. Code: | PAB |
| Lead Count (#): | 3 |
| Pkg. Dimensions (mm): | 2.92 x 1.30 x 0.00 |
| Pitch (mm): |
环境和出口类别
| Moisture Sensitivity Level (MSL) | 1 |
| Pb (Lead) Free | Yes |
| ECCN (US) | EAR99 |
| HTS (US) | 8542.39.0090 |
| RoHS (ISL60002BAH333Z-T7A) | 下载 |
产品属性
| Lead Count (#) | 3 |
| Carrier Type | Reel |
| Moisture Sensitivity Level (MSL) | 1 |
| Pb (Lead) Free | Yes |
| Pb Free Category | Pb-Free 100% Matte Tin Plate w/Anneal-e3 |
| Temp. Range (°C) | -40 to +105°C |
| Country of Assembly | THAILAND |
| Country of Wafer Fabrication | UNITED STATES |
| Hysteresis (ppm) | 100 |
| IS (mA) | 0.0009 |
| ISINK (Max) (mA) | 7 |
| ISOURCE (Max) (mA) | 7 |
| Initial Accuracy (% Vout) (% Vout) | 0.03 |
| Initial Accuracy (mV (±)) (mV (±)) | 1 |
| LTD Stability (ppm) | 50 |
| Length (mm) | 2.9 |
| Low Frequency Noise (µVPP) | 30 |
| MOQ | 250 |
| Output Noise (Typical) | 30 µVPP |
| Parametric Category | Voltage References |
| Pkg. Dimensions (mm) | 2.9 x 1.3 x 0.00 |
| Pkg. Type | SOT23 |
| Price (USD) | $5.42372 |
| Qualification Level | Standard |
| Supply Voltage Vs Range | 3.5 to 5.5 |
| Technology | Floating Gate Array |
| Temperature Coefficient (ppm/°C) | 20 |
| VOUT (V) | 3.3 |
| VS (Max) (V) | 5.5 |
| VS (Min) (V) | 3.5 |
| Width (mm) | 1.3 |
有关 ISL60002BAH333 的资源
描述
The ISL60002 FGA voltage references are very high precision analog voltage references fabricated using the Renesas proprietary Floating Gate Analog (FGA) technology and feature low supply voltage operation at ultra-low 350nA operating current. Additionally, the ISL60002 family features guaranteed initial accuracy as low as ±1. 0mV and 20ppm/°C temperature coefficient. The initial accuracy and temperature stability performance of the ISL60002 family, plus the low supply voltage and 350nA power consumption, eliminates the need to compromise thermal stability for reduced power consumption, making it an ideal companion to high resolution, low power data conversion systems. Special Note: Post-assembly x-ray inspection may lead to permanent changes in device output voltage and should be minimized or avoided.