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瑞萨电子 (Renesas Electronics Corporation)
Dual 3A/Single 6A Step-Down DC/DC Power Module

封装信息

CAD 模型:View CAD Model
Pkg. Type:Module
Pkg. Code:YGN
Lead Count (#):23
Pkg. Dimensions (mm):9.0 x 6.5 x 1.85
Pitch (mm):0.5

环境和出口类别

Moisture Sensitivity Level (MSL)3
Pb (Lead) FreeYes
ECCN (US)
HTS (US)

产品属性

Lead Count (#)23
Carrier TypeReel
Moisture Sensitivity Level (MSL)3
Pb (Lead) FreeYes
Pb Free CategoryPb-Free 100% Matte Tin Plate w/Anneal-e3
Temp. Range (°C)-40 to +85°C
ConfigurationNormal
Control TypeCurrent Mode
Current SharingYes
Digital BusNo
Input Voltage (Max) (V)6
Input Voltage (Min) (V)2.85
Length (mm)9
Longevity2033 十二月
MOQ1000
Output Current (Max) [Rail 1] (A)6
Output Voltage (Max) (V)5
Output Voltage (Min) (V)0.8
PORNo
Parametric CategoryAnalog-Interface Power Modules
Peak Efficiency (%)95
Pitch (mm)0.5
Pkg. Dimensions (mm)9.0 x 6.5 x 1.85
Pkg. TypeModule
Pvin (Max)6
Pvin (Min)2.85
Qualification LevelStandard
Quiescent Current13 mA
SYNCH CapabilityYes
Switching Frequency Range (Typical) (kHz)2640 - 4000
Thickness (mm)1.85
Width (mm)6.5

描述

The ISL8203M is an integrated step-down power module rated for dual 3A output current or 6A current sharing operation. Optimized for generating low output voltages down to 0. 8V, the ISL8203M is ideal for any low power low voltage applications. The supply voltage range is from 2. 85V to 6V. The two channels are 180° out-of-phase for input RMS current and EMI reduction. Each channel is capable of 3A output current. They can be combined to form a single 6A output in current sharing mode. While in current sharing mode, the interleaving of the two channels reduces input and output voltage ripple. The ISL8203M offers an independent Power-Good (PG) signal for each channel. When shut down, the ISL8203M discharges the output capacitor. Other features include internal digital soft-start, enable for power sequence, overcurrent protection and over-temperature protection. The ISL8203M integrates a PWM controller, synchronous switching MOSFETs, inductors and passive components to maximize efficiency and minimize external component count. The ISL8203M is available in a thermally-enhanced, compact QFN package.