| CAD 模型: | View CAD Model |
| Pkg. Type: | Module |
| Pkg. Code: | YGJ |
| Lead Count (#): | 26 |
| Pkg. Dimensions (mm): | 17.00 x 17.00 x 7.50 |
| Pitch (mm): | 1 |
| Moisture Sensitivity Level (MSL) | 4 |
| Pb (Lead) Free | Exempt |
| ECCN (US) | |
| HTS (US) |
| Lead Count (#) | 26 |
| Carrier Type | Reel |
| Moisture Sensitivity Level (MSL) | 4 |
| Pb (Lead) Free | Exempt |
| Pb Free Category | Pb-Free 100% Matte Tin Plate w/Anneal-e3 |
| Temp. Range (°C) | -40 to +125°C |
| Configuration | Normal |
| Control Type | Voltage Mode |
| Current Sharing | Yes |
| Digital Bus | No |
| Input Voltage (Max) (V) | 20 |
| Input Voltage (Min) (V) | 4.5 |
| Length (mm) | 17 |
| MOQ | 1000 |
| Output Current (Max) [Rail 1] (A) | 30 |
| Output Voltage (Max) (V) | 7.5 |
| Output Voltage (Min) (V) | 0.6 |
| POR | Yes |
| Parametric Category | Analog-Interface Power Modules |
| Peak Efficiency (%) | 95 |
| Pitch (mm) | 1 |
| Pkg. Dimensions (mm) | 17.0 x 17.0 x 7.50 |
| Pkg. Type | Module |
| Price (USD) | $33.345 |
| Pvin (Max) | Internal Linear Reg |
| Pvin (Min) | Internal Linear Reg |
| Qualification Level | Standard |
| Quiescent Current | 131 mA |
| SYNCH Capability | Yes |
| Switching Frequency Range (Typical) (kHz) | 150 - 1500 |
| Thickness (mm) | 7.5 |
| Width (mm) | 17 |
The ISL8225M is a fully-encapsulated step-down switching power supply that can deliver up to 100W output power from a small 17mm square PCB footprint. The two 15A outputs may be used independently or combined to deliver a single 30A output. Designing a high-performance board mounted power supply has never been simpler -- only a few external components are needed to create a very dense and reliable power solution. Automatic current sharing and phase interleaving allow up to six modules to be paralleled for 180A output capability. 1. 5% output voltage accuracy, differential remote voltage sensing and fast transient response create a very high-performance power system. Built-in output overvoltage, overcurrent and over-temperature protection enhance system reliability. The ISL8225M is available in a thermally-enhanced QFN package. Excellent efficiency and low thermal resistance permit full power operation without heat sinks or fans. In addition, the QFN package with external leads permits easy probing and visual solder inspection.