封装信息
| CAD 模型: | View CAD Model |
| Pkg. Type: | Module |
| Pkg. Code: | YGJ |
| Lead Count (#): | 26 |
| Pkg. Dimensions (mm): | 17.00 x 17.00 x 7.50 |
| Pitch (mm): | 1 |
环境和出口类别
| Moisture Sensitivity Level (MSL) | 4 |
| Pb (Lead) Free | Exempt |
| ECCN (US) | |
| HTS (US) |
产品属性
| Lead Count (#) | 26 |
| Carrier Type | Tray |
| Moisture Sensitivity Level (MSL) | 4 |
| Pb (Lead) Free | Exempt |
| Pb Free Category | Pb-Free 100% Matte Tin Plate w/Anneal-e3 |
| Temp. Range (°C) | -40 to +125°C |
| Configuration | Normal |
| Control Type | Voltage Mode |
| Current Sharing | Yes |
| Digital Bus | No |
| Input Voltage (Max) (V) | 20 |
| Input Voltage (Min) (V) | 4.5 |
| Length (mm) | 17 |
| MOQ | 650 |
| Output Current (Max) [Rail 1] (A) | 40 |
| Output Voltage (Max) (V) | 2.5 |
| Output Voltage (Min) (V) | 0.6 |
| POR | Yes |
| Parametric Category | Analog-Interface Power Modules |
| Peak Efficiency (%) | 94 |
| Pitch (mm) | 1 |
| Pkg. Dimensions (mm) | 17.0 x 17.0 x 7.50 |
| Pkg. Type | Module |
| Pvin (Max) | Internal Linear Reg |
| Pvin (Min) | Internal Linear Reg |
| Qualification Level | Standard |
| Quiescent Current | 140 mA |
| SYNCH Capability | Yes |
| Simulation Model Available | iSim |
| Switching Frequency Range (Typical) (kHz) | 350 - 700 |
| Thickness (mm) | 7.5 |
| Width (mm) | 17 |
有关 ISL8240M 的资源
描述
The ISL8240M is a fully-encapsulated step-down switching power supply that can deliver up to 100W output power from a small 17mmx17mm PCB footprint. The two 20A outputs may be used independently or combined to deliver a single output of 40A. Designing a high-performance board-mounted power supply has never been simpler -- only a few external components are needed to create a very dense and reliable power solution. 1. 5% output voltage accuracy, differential remote voltage sensing and fast transient response create a very high-performance power system. Built-in output overvoltage, overcurrent and over-temperature protection enhance system reliability. The ISL8240M is available in a thermally-enhanced QFN package. Excellent efficiency and low thermal resistance permit full power operation without heat sinks or fans. In addition, the QFN package with external leads permits easy probing and visual solder inspection.