封装信息
| Lead Count (#) | 54 |
| Pkg. Type | TSOP |
| Pkg. Code | PHG54 |
| Pitch (mm) | 0.8 |
| Pkg. Dimensions (mm) | 22.22 x 10.16 x 1.0 |
环境和出口类别
| Moisture Sensitivity Level (MSL) | 3 |
| Pb (Lead) Free | Yes |
| ECCN (US) | |
| HTS (US) |
产品属性
| Pkg. Type | TSOP |
| Lead Count (#) | 54 |
| Description | 16Mb Parallel Asynchronous x16, 35ns |
| Temp. Range | -40 to 85°C |
| Carrier Type | Tray |
| Price (USD) | 1ku | 46.69896 |
| Density (Kb) | 16384 |
| Function | Non-Volatile Memory |
| I/O Voltage (V) | 3 - 3 |
| Interface | Parallel |
| Length (mm) | 22.22 |
| MOQ | 96 |
| Moisture Sensitivity Level (MSL) | 3 |
| Operating Voltage Range (V) | 2.70 - 3.60 |
| Pb (Lead) Free | Yes |
| Pb Free Category | e3 Sn |
| Pitch (mm) | 0.8 |
| Pkg. Dimensions (mm) | 22.22 x 10.16 x 1.0 |
| Qty. per Carrier (#) | 96 |
| Qty. per Reel (#) | 0 |
| Speed | 35ns |
| Tape & Reel | No |
| Thickness (mm) | 1 |
| Width (mm) | 10.16 |
描述
The M3016316 is a high performance parallel interface non-volatile MRAM with 16Mbit density. It features SRAM compatible read and write access times of 35ns or 45ns. It operates from -40° to +85° (industrial version) and -40°C to +105°C (industrial plus version). The device is offered in 48-ball FBGA and 54-TSOP packages.