封装信息
| CAD 模型: | View CAD Model |
| Pkg. Type: | SOP |
| Pkg. Code: | pkg_667 |
| Lead Count (#): | 8 |
| Pkg. Dimensions (mm): | 5 x 4 x 1.75 |
| Pitch (mm): |
环境和出口类别
| RoHS (R2A20133BSP#W5) | 英语日文 |
| Moisture Sensitivity Level (MSL) | |
| Pb (Lead) Free | Yes |
| ECCN (US) | |
| HTS (US) |
产品属性
| Pkg. Type | SOP |
| Carrier Type | Embossed Tape |
| Function | 2nd OVP (Non latch), Off Time control |
| Icc (Typical) (mA) | 1.8 |
| Lead Compliant | Yes |
| Lead Count (#) | 8 |
| Length (mm) | 5 |
| MOQ | 2500 |
| Pb (Lead) Free | Yes |
| Pkg. Dimensions (mm) | 5 x 4 x 1.75 |
| Remarks | CRM Single PFC |
| Tape & Reel | No |
| Thickness (mm) | 1.75 |
| Tstg (Max) (°C) | 150 |
| Tstg (Min) (°C) | -55 |
| Width (mm) | 4 |
有关 R2A20133BSP 的资源
描述
Support is limited to customers who have already adopted these products.
Equipped with a variety of functions for improving efficiency, driving higher efficiency and eco-friendliness for power supply systems of electric devices, and thus society as a whole. Driver ICs are also available for high-accuracy, high-efficiency LED lighting systems.