封装信息
| CAD 模型: | View CAD Model |
| Pkg. Type: | SOP |
| Pkg. Code: | pkg_34 |
| Lead Count (#): | 20 |
| Pkg. Dimensions (mm): | 12.6 x 5.5 x 2.2 |
| Pitch (mm): |
环境和出口类别
| Moisture Sensitivity Level (MSL) | 1 |
| Pb (Lead) Free | Yes |
| ECCN (US) | EAR99 |
| HTS (US) | 8542.39.0040 |
| RoHS (R2A20169SP#W5) | 英语日文 |
产品属性
| Lead Count (#) | 20 |
| Carrier Type | Tape & Reel |
| Moisture Sensitivity Level (MSL) | 1 |
| Pb (Lead) Free | Yes |
| Country of Assembly | VIETNAM, JAPAN |
| Country of Wafer Fabrication | JAPAN |
| Application | D/A Converter |
| Icc (Typical) (mA) | 0.6 |
| Io (mA) | 2 |
| Lead Compliant | Yes |
| Length (mm) | 13 |
| MOQ | 2000 |
| Output I/V | V |
| Pkg. Dimensions (mm) | 13 x 6 x 2.2 |
| Pkg. Type | SOP |
| Price (USD) | $1.40919 |
| Remarks | 2.7 to 5.5V Builtin Power On Reset |
| Resolution (bits) | 8 |
| Supply Voltage (V) | 3 - 5 |
| Supply Voltage Vs Range | 3 to 5 |
| Tape & Reel | No |
| Thickness (mm) | 2.2 |
| Width (mm) | 6 |
有关 R2A20169SP 的资源
描述
The R2A20169 is an integrated circuit semiconductor of CMOS structure with 12 channels of built in D/Aunnecessary and enabling configuration of a system with few component parts. Serial data transfer type input can easily be used through a combination of three lines: DI, CLK, and LD. Outputs incorporate buffer op-amps that have a drive capacity of 1 mA or above for both sink source, and can operate over the entire voltage range from almost ground to Vcc ( 0 to 5V ), making peripheral elements unnecessary and enabling configuration of a system with few component parts. Very small QFN package is added to lineup. It is suitable for a small mounting and reduces the mounting area.