封装信息
| Pkg. Code | pkg_447 |
| Lead Count (#) | 20 |
| Pkg. Type | LSSOP |
| Pkg. Dimensions (mm) | 6.5 x 4.4 x 1.45 |
环境和出口类别
| ECCN (US) | 3A991 |
| RoHS (R5F21282SDSP#W4) | 英语日文 |
| Moisture Sensitivity Level (MSL) | 3 |
| Pb (Lead) Free | Yes |
| HTS (US) |
产品属性
| Carrier Type | Embossed Tape |
| ADC | 10-bit x 4-ch |
| Bit Size | 16 |
| CPU | R8C |
| DMA | No |
| Data Flash (KB) | 0 |
| Ethernet | No |
| Family Name | R8C |
| I/O Ports | 13 |
| LVD or PVD | Yes |
| Lead Compliant | Yes |
| Lead Count (#) | 20 |
| Length (mm) | 6 |
| MOQ | 2500 |
| Moisture Sensitivity Level (MSL) | 3 |
| Operating Freq (Max) (MHz) | 20 |
| Pb (Lead) Free | Yes |
| Pkg. Dimensions (mm) | 6 x 4 x 1.45 |
| Pkg. Type | LSSOP |
| Program Memory (KB) | 8 |
| RAM (KB) | 0.5 |
| RTC | Yes |
| Supply Voltage (V) | 2.2 - 5.5 |
| Tape & Reel | No |
| Temp. Range | -40 to +85°C |
| Thickness (mm) | 1.45 |
| Timer | 8-bit x 3-ch, 16-bit x 1-ch |
| Width (mm) | 4 |
描述
The R8C/28 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.
These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data flash (1KB × 2 blocks). The difference between the R8C/26 Group and R8C/27 Group is only the presence or absence of data flash. Their peripheral functions are the same.