封装信息
| CAD 模型: | View CAD Model |
| Pkg. Type: | LSSOP |
| Pkg. Code: | pkg_447 |
| Lead Count (#): | 20 |
| Pkg. Dimensions (mm): | 6.5 x 4.4 x 1.45 |
| Pitch (mm): | 0.65 |
环境和出口类别
| RoHS (R5F212H1SDSP#W4) | 英语日文 |
| Moisture Sensitivity Level (MSL) | 3 |
| Pb (Lead) Free | Yes |
| ECCN (US) | |
| HTS (US) |
产品属性
| Carrier Type | Embossed Tape |
| Bit Size | 16 |
| CPU | R8C |
| DMA | No |
| Data Flash (KB) | 0 |
| Ethernet | No |
| Family Name | R8C |
| I/O Ports | 15 |
| LVD or PVD | Yes |
| Lead Compliant | Yes |
| Lead Count (#) | 20 |
| Length (mm) | 6 |
| MOQ | 2500 |
| Moisture Sensitivity Level (MSL) | 3 |
| Operating Freq (Max) (MHz) | 8 |
| Pb (Lead) Free | Yes |
| Pkg. Dimensions (mm) | 6 x 4 x 1.45 |
| Pkg. Type | LSSOP |
| Program Memory (KB) | 4 |
| RAM (KB) | 0.25 |
| RTC | Yes |
| Supply Voltage (V) | 2.2 - 5.5 |
| Tape & Reel | No |
| Temp. Range (°C) | -40 to +85 |
| Thickness (mm) | 1.45 |
| Timer | 8-bit x 3-ch, 16-bit x 1-ch |
| Width (mm) | 4 |
有关 R8C/2H 的资源
描述
The R8C/2H Group is supported only for customers who have already adopted these products. The RL78/G11 Group is recommended for new designs.
The R8C/2G Group of single-chip MCUs incorporates the R8C/Tiny Series CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.
Power consumption is low, and the supported operating modes allow additional power control. These MCUs also use an anti-noise configuration to reduce emissions of electromagnetic noise and are designed to withstand EMI. Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of system components.