封装信息
| CAD 模型: | View CAD Model |
| Pkg. Type: | |
| Pkg. Code: | |
| Lead Count (#): | |
| Pkg. Dimensions (mm): | |
| Pitch (mm): |
环境和出口类别
| RoHS (R5F21336ANFP#X6) | 英语日文 |
| Moisture Sensitivity Level (MSL) | |
| Pb (Lead) Free | Yes |
| ECCN (US) | |
| HTS (US) |
产品属性
| DMA | No |
| Ethernet | No |
| Family Name | R8C |
| LVD or PVD | No |
| Lead Compliant | Yes |
| MOQ | 1000 |
| Pb (Lead) Free | Yes |
| RTC | No |
| Tape & Reel | No |
有关 R8C/33A 的资源
描述
The R8C/33A Group is supported only for customers who have already adopted these products. The R8C/33C Group or R8C/33M Group is recommended for new designs.
The R8C/33A Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.
Power consumption is low, and the supported operating modes allow additional power control. These MCUs are designed to maximize EMI/EMS performance. Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of system components. The R8C/33A Group has data flash (1KB × 4 blocks) with the background operation (BGO) function.