封装信息
| CAD 模型: | View CAD Model |
| Pkg. Type: | QFN |
| Pkg. Code: | |
| Lead Count (#): | 64 |
| Pkg. Dimensions (mm): | 9 x 9 x 0.9 |
| Pitch (mm): |
环境和出口类别
| Moisture Sensitivity Level (MSL) | 3 |
| Pb (Lead) Free | Yes |
| RoHS (R9A06G037GNP#AA0) | 英语日文 |
| ECCN (US) | |
| HTS (US) |
产品属性
| Lead Count (#) | 64 |
| Moisture Sensitivity Level (MSL) | 3 |
| Pb (Lead) Free | Yes |
| Temp. Range (°C) | -40 to +85 |
| Country of Assembly | TAIWAN |
| Country of Wafer Fabrication | JAPAN |
| Function | PLC Modem IC |
| Lead Compliant | Yes |
| Length (mm) | 9 |
| MOQ | 1 |
| Pkg. Dimensions (mm) | 9 x 9 x 0.9 |
| Pkg. Type | QFN |
| Price (USD) | $3.1192 |
| Tape & Reel | No |
| Thickness (mm) | 0.9 |
| Width (mm) | 9 |
有关 R9A06G037 的资源
描述
The R9A06G037 is a high-performance Narrow Band Power Line Communication (NB-PLC) modem IC. It integrates a high-performance DSP core and an MCU core (Arm® Cortex®-M3). The DSP core mainly handles the PLC PHY layer protocol and the Arm core handles the upper layer protocol. R9A06G037 can support a variety of PLC protocols such as G3-PLC (CENELEC, ARIB, and FCC), PRIME, and many others.