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Rogowski Coil Based Power-Line Current Sensor with Amplifier, Contactless AC Current Measurements in the Range of 2A to 5000A

封装信息

Lead Count (#) 16
Pkg. Type TSSOP
Pkg. Code MNO
Pitch (mm) 0.65
Pkg. Dimensions (mm) 5.00 x 4.39 x 0.00

环境和出口类别

Moisture Sensitivity Level (MSL) 1
Pb (Lead) Free Yes
ECCN (US) EAR99
HTS (US) 8542390001
RoHS (RAA788000GSP#HA0) 下载

产品属性

Pkg. Type TSSOP
Lead Count (#) 16
Carrier Type Reel
Moisture Sensitivity Level (MSL) 1
Pb (Lead) Free Yes
Pb Free Category Pb-Free 100% Matte Tin Plate w/Anneal-e3
Country of Assembly Taiwan
Country of Wafer Fabrication Japan
Price (USD) | 1ku 3.21
DDR Capable No
Input Voltage (Max) (V) 3.6
Input Voltage (Max) [Rail 1] (V) 3.6 - 3.6
Input Voltage (Min) (V) 2.7
Input Voltage (Min) [Rail 1] (V) 2.7
Length (mm) 5
Linear Output Yes
MOQ 2500
Output Current (Max) [Rail 1] (A) 0.3
Output Current 1 (Max) (A) 0.3
Output Voltage (Max) (V) 3.6
Output Voltage (Min) (V) 0.01
Output Voltage 1 (Max) (V) 3.6
Outputs (#) 1
Outputs (Max) (#) 1
Parametric Category Boost Controllers (External FETs)
Pitch (mm) 0.7
Pkg. Dimensions (mm) 5.0 x 4.4 x 0.00
Qualification Level Standard
Switching Frequency Range (Typical) (kHz) 50 - 60
Temp. Range -40 to +125°C
Thickness (mm) 0
Topology [Rail 1] Buck
Width (mm) 4.4

描述

The RAA788000 is a low-power, power-line current sensor for contactless AC current measurements in the range of 2A to 5000A. The device consists of an on-chip Rogowski coil, a buffer amplifier, and a signal amplifier.

From an alternating power-line current, the magnetic flux flows through the on-chip coil, generating an electromotive force (EMF) that is amplified and filtered by a signal amplifier.

The amplifier output is typically fed into an analog-to-digital converter with a subsequent signal processor that calculates the current magnitude.

The RAA788000 operates from a single 2.7V to 3.6V supply. The device is available in a small 16 Ld TSSOP package and has an operation specified for the temperature range from -40°C to +105°C.

The RAA788000 is available in a 16 Ld thin shrink small outline package (TSSOP).