| CAD 模型: | View CAD Model |
| Pkg. Type: | MSOP |
| Pkg. Code: | PVSP0008JA-A |
| Lead Count (#): | 8 |
| Pkg. Dimensions (mm): | |
| Pitch (mm): | 0.65 |
| Moisture Sensitivity Level (MSL) | 1 |
| ECCN (US) | EAR99 |
| HTS (US) | 8542.33.0001 |
| Pb (Lead) Free | Yes |
| Pkg. Type | MSOP |
| Carrier Type | Embossed Tape |
| Moisture Sensitivity Level (MSL) | 1 |
| Country of Assembly | JAPAN |
| Country of Wafer Fabrication | JAPAN |
| Automotive Qual. | Yes |
| Bandwidth (MHz) | 4 |
| CMRR (dB) | 100 |
| Channels (#) | 2 |
| Common Mode Input Voltage Range (V) | 3 - 32 |
| Dual Supplies (±V) | 16 - 16 |
| Dual Supply Range (V) | V+-16V(Max.) |
| Enable | - |
| Family Name | General-purpose Op Amps |
| Function | Automotive Grade High Voltage Bipolar Dual Operational AmplifierHigh Speed, Wide Band, Low Input Offset Voltage VIO max 1mVAll Temperature (-40 to 125deg.) Rating |
| Gain Min | 25000 |
| IBIAS (nA) | 6 |
| IOUT (A) | 0.03 |
| IS (mA) | 4.3 |
| IS per Amp (mA) | 2.15 |
| Input Offset Voltage Vio (Max) (mV (±)) | 1 |
| Lead Compliant | No |
| Lead Count (#) | 8 |
| Length (mm) | 2.9 |
| MOQ | 5000 |
| Min Operating Temperature (°C) | -40 |
| Offset Voltage (Max) (mV) | 1 |
| Output Voltage Swing Range (V) | VOL1 +13.7 - -13.7, VOL2 +13.5 - -13.5 |
| Pb (Lead) Free | Yes |
| Pb Free Category | Yes |
| Pitch (mm) | 0.65 |
| Process | Bipolar |
| Qty. per Reel (#) | 5000 |
| Qualification Level | Automotive(AEC-Q100 Compliant) |
| Rail-to-Rail Input | No |
| Rail-to-Rail Output | No |
| Simulation Model Available | SPICE |
| Single Supply Voltage Range (V) | 3 - 32 |
| Slew Rate (V/µs) | 5.5 |
| Supply Current Icc/Idd (Max) (mA) | 6 |
| Supply Voltage Vcc Range | 3 - 32 |
| Tape & Reel | Yes |
| Temp. Range (°C) | -40 to +125 |
| Thermal Shutdown | No |
| Topology [Rail 1] | - |
| VS (Max) (V) | 32 |
| VS (Min) (V) | 3 |
| Width (mm) | 2.8 |
REAC842J 是一款单功率双运算放大器,具有低输入失调电压(VIO ≤ ±1mV)和低输入失调电压温度漂移(Ta = -40 °C 至 +125 °C)。 该器件内置高速 PNP 晶体管,提升了压摆率、增益带宽积以及负载电容驱动的稳定性等特性,并且相较于 REAC1251 无交越失真。
由于该产品具有高压摆率,能够实现高速信号放大,适用于电机等多种传感器应用。 此外,得益于其小巧的封装(MSOP),可将其安装在传感器附近,进而减小电路板尺寸,提升设计的灵活性。