封装信息
| CAD 模型: | View CAD Model |
| Pkg. Type: | WAFER |
| Pkg. Code: | DICEW |
| Lead Count (#): | |
| Pkg. Dimensions (mm): | 0.0 x 0.0 x 0.0 |
| Pitch (mm): |
环境和出口类别
| Moisture Sensitivity Level (MSL) | |
| Pb (Lead) Free | Yes |
| ECCN (US) | |
| HTS (US) |
产品属性
| Pkg. Type | WAFER |
| Lead Count (#) | 0 |
| Carrier Type | WFP |
| Pb (Lead) Free | Yes |
| Pb Free Category | e3 Sn |
| Temp. Range (°C) | -40 to 105°C |
| Country of Wafer Fabrication | USA |
| Application | 100Gbps DP-QPSK coherent pluggable module applications |
| Channels (#) | 4 |
| Data Rate Max (Gbps) | 32 |
| Function | Linear TIA |
| MOQ | 154 |
| Pkg. Dimensions (mm) | 0.0 x 0.0 x 0.0 |
| Price (USD) | $86.23565 |
| Qty. per Carrier (#) | 0 |
| Qty. per Reel (#) | 0 |
| Requires Terms and Conditions | Does not require acceptance of Terms and Conditions |
| Tape & Reel | No |
| 已发布 | No |
有关 RG8G32423 的资源
描述
The RG8G32423 is a 32Gbaud, low-power, quad-channel linear transimpedance amplifier (TIA) that is designed for 100Gbps DP-QPSK coherent pluggable module applications.
The RG8G32423 has integrated quad lanes of TIAs for XI, XQ, YI, and YQ channels, as well as serial peripheral interface (SPI) circuitry for DC controls on a single die. The TIA electrical characteristics, functions, and physical dimensions are designed for small form factor (SFF) integrated optical subassembly modules.
The RG8G32423 is delivered as die formed with solder bumps for the flip-chip assembly.