封装信息
| Lead Count (#) | 0 |
| Pkg. Type | WAFER |
| Pkg. Code | DICEW |
| Pitch (mm) | |
| Pkg. Dimensions (mm) | 0.0 x 0.0 x 0.0 |
环境和出口类别
| Moisture Sensitivity Level (MSL) | 0 |
| Pb (Lead) Free | Yes |
| ECCN (US) | 5A991B1 |
| HTS (US) | 8542330001 |
产品属性
| Pkg. Type | WAFER |
| Lead Count (#) | 0 |
| Carrier Type | WFP |
| Moisture Sensitivity Level (MSL) | 0 |
| Pb (Lead) Free | Yes |
| Pb Free Category | e3 Sn |
| Temp. Range | -40 to 105°C |
| Price (USD) | 1ku | 86.23565 |
| Country of Wafer Fabrication | United States |
| Application | 100Gbps DP-QPSK coherent pluggable module applications |
| Channels (#) | 4 |
| Data Rate Max (Gbps) | 32 |
| Function | Linear TIA |
| Length (mm) | 0.0 |
| MOQ | 154 |
| Pitch (mm) | 0.0 |
| Pkg. Dimensions (mm) | 0.0 x 0.0 x 0.0 |
| Qty. per Carrier (#) | 0 |
| Qty. per Reel (#) | 0 |
| Requires Terms and Conditions | Does not require acceptance of Terms and Conditions |
| Tape & Reel | No |
| Thickness (mm) | 0.0 |
| Width (mm) | 0.0 |
描述
The RG8G32423 is a 32Gbaud, low-power, quad-channel linear transimpedance amplifier (TIA) that is designed for 100Gbps DP-QPSK coherent pluggable module applications.
The RG8G32423 has integrated quad lanes of TIAs for XI, XQ, YI, and YQ channels, as well as serial peripheral interface (SPI) circuitry for DC controls on a single die. The TIA electrical characteristics, functions, and physical dimensions are designed for small form factor (SFF) integrated optical subassembly modules.
The RG8G32423 is delivered as die formed with solder bumps for the flip-chip assembly.